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Tackling ASIC warpage with thermal innovation

As ASICs grow in size and power, managing thermal stress is critical. Henkel’s latest article explores how next-gen thermal interface materials (TIMs) reduce die warpage, resist pump-out, and improve reliability in high-performance electronics.

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As ASIC dies become more power-dense and footprints expand to enable greater function, warpage can become exacerbated. Some die in modern AI devices can measure as large as 60 mm x 60 mm, and those dimensions only stand to increase.

The challenge is developing a low thermal impedance, thin, pump-out resistant TIM to secure efficient heat transfer and improve reliability even after thousands of thermal cycles. Naturally, material properties can be modified to address aspects like adhesion and viscosity, but these alterations may also have undesirable consequences.

Henkel is developing a new phase change TIM to combat pump-out:

It offers high viscosity and increased tack to stay in place under stress
The TIM maintains stability through 1,000+ thermal cycles
It delivers low thermal resistance comparable to current TIMs
It helps reduce die warpage by managing thermal stress

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Improving power module reliability with LOCTITE^® phase change material

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Tackling ASIC warpage with thermal innovation

Get access now

Henkel is developing a new phase change TIM to combat pump-out:

Related products

More information

Improving power module reliability with LOCTITE^® phase change material

Learn how a new drive system design removed operational heat with thermal management materials.

Looking for solutions? We can help

Company

Help

Resource center

Social media

Tackling ASIC warpage with thermal innovation

Get access now

Henkel is developing a new phase change TIM to combat pump-out:

Related products

More information

Improving power module reliability with LOCTITE® phase change material

Learn how a new drive system design removed operational heat with thermal management materials.

Looking for solutions? We can help

Company

Help

Resource center

Social media

Improving power module reliability with LOCTITE^® phase change material