Electrically non-conductive adhesives
Dual-cure non-conductive adhesive for temperature sensitive electronic parts
Electrically non-conductive adhesive designed for use in the assembly of temperature-sensitive electronic components. A dual cure system allows for maximum performance.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
For good electrically non-conductive adhesion to a variety of substrates, try LOCTITE® ECCOBOND LUX 3042M. This dual cure adhesive is specially designed for assembling temperature sensitive electronic components, and is formulated to initially cure when exposed to UV light, followed by a secondary thermal cure for maximum performance.
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Electrically non-conductive
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Dual cure
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1-part: no mixing required
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Good adhesion on various substrates
- Product category:
- Electrically non-conductive adhesives
Technologies:
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Thermosets, electronics assembly materials
- Cure schedule light intensity:
- 100.0 mW/cm²
- Cure schedule, @ 120.0 °C:
- 30.0 min.
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Storage temperature:
- -40.0 °C
- Thixotropic index:
- 1.2
- Viscosity, Cone 20 mm, Angle 2°, Spindle TA, Shear Rate 15 s⁻¹:
- 85000.0 mPa·s (cP)
