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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Electrically non-conductive adhesives


Dual-cure non-conductive adhesive for temperature sensitive electronic parts

Electrically non-conductive adhesive designed for use in the assembly of temperature-sensitive electronic components. A dual cure system allows for maximum performance.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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For good electrically non-conductive adhesion to a variety of substrates, try LOCTITE® ECCOBOND LUX 3042M. This dual cure adhesive is specially designed for assembling temperature sensitive electronic components, and is formulated to initially cure when exposed to UV light, followed by a secondary thermal cure for maximum performance.

Product category:

Electrically non-conductive adhesives


Cure schedule light intensity:

100.0 mW/cm²

Cure schedule, @ 120.0 °C:

30.0 min.

Cure type:

Heat cure

Number of components:

1 part

Storage temperature:

-40.0 °C

Thixotropic index:


Viscosity, Cone 20 mm, Angle 2°, Spindle TA, Shear Rate 15 s⁻¹:

85000.0 mPa·s (cP)

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