Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically non-conductive adhesives

LOCTITE® ECCOBOND LUX 3042M

Dual cure, non-conductive adhesive for temperature sensitive electronic components  

Electrically non-conductive adhesive designed for use in the assembly of temperature sensitive electronic components. A dual cure system allows for maximum performance. 

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Documents

Information

For good, electrically non-conductive adhesion to a variety of substrates, try LOCTITE® ECCOBOND LUX 3042M. This dual cure adhesive is specially designed for assembling temperature sensitive electronic components, and is formulated to initially cure when exposed to UV light, followed by a secondary thermal cure for maximum performance. 

Cure schedule light intensity:

100.0 mW/cm²

Cure schedule, @ 120.0 °C:

30.0 min.

Cure type:

Heat Cure

Number of components:

1 Part

Storage temperature:

-40.0 °C

Thixotropic index:

1.2

Viscosity, Cone 20 mm, Angle 2°, Spindle TA, Shear Rate 15 s⁻¹:

85000.0 mPa·s (cP)

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