Low-modulus, high-conductivity Bergquist^® GAP PAD^® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Bergquist^® and LOCTITE^® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist^® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.