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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Hotspot - Green Bay Packaging

TECHNOMELT<sup>®</sup> PUR 3317 BR

92%

Swaying consumer purchase decisions of shoppers say sustainability is important when choosing a brand.
~By comparison, 90% of consumers in the U.S. like chocolate.

5) https://www.foodbeverageinsider.com/confectionery/chocolate-the-preferred-candy-in-america-poll-finds

Brands are adopting eco-friendly packaging and mandating it from converters, encompassing all elements of packaging: base material, adhesives, and inks (i.e., soy-based inks).

The PVH apparel company, a global fashion group (i.e., Calvin Klein, Tommy Hilfiger), converted 74% of its packaging to fully recyclable and aims to reach 100% by 2025.6)

6) https://www.forbes.com/advisor/business/small-business-statistics/

Regulated by legislation such as

The Extended Producer Responsibility (EPR)

The Inflation Reduction Act (IRA)

The U.S. Break Free from Plastic Pollution Act of 2021 (BFFPPA)

01 eCommerce

Green Bay Packaging should deepen collaborations with key suppliers (like Henkel). The goal is to find or co-create innovative material solutions that often must meet conflicting performance requirements in eCommerce packaging. A powerful example is the EPIX® technology portfolio. Learn more here.

Rendered graphic of a line card with multiple heatsinks inserted over a transparent background.
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components. They are available in self-shimming and non-self-shimming options to satisfy application-specific requirements and ease of use.

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance. Dispensable for high-volume manufacturing, thermal gels are available in thermal conductivities up to 6.0 W/m-K, and provide a range of attributes including low volatility, high vertical gap stability, and reliability in challenging environments.

Phase Change Materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function. Bergquist® phase change materials are the optimal solution, providing a mess-free alternative to thermal grease.

Rendered graphic of a line card with multiple heatsinks inserted over a transparent background.
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance for IC devices not requiring a larger heat sink attachment.

Hotspot - sustainability

Rendered graphic of a line card with multiple heatsinks inserted over a transparent background.
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance.

Source:

Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components.

Source:

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance.

Source:

Phase Change Materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function.

Source:

Hotspot - alternative sustainability module

Rendered graphic of a line card with multiple heatsinks inserted over a transparent background.
Thermal GAP PAD® materials

Low-modulus, high-conductivity Bergquist® GAP PAD® materials provide excellent conformability and low-stress thermal performance.

Source:

Thermally conductive adhesives

Bergquist® and LOCTITE® thermally conductive adhesives are designed to provide excellent heat dissipation for thermally sensitive components.

Source:

Thermal gels

One-part, liquid formable gel materials provide a balance between process flexibility, low component stress and high-reliability thermal performance.

Source:

Phase Change Materials

Larger, high-performance Layer 1/Layer 2 ASIC and/FPGA devices must effectively dissipate heat for proper function.

Source:

TECHNOMELT<sup>®</sup> PUR 3317 BR

92%

Swaying consumer purchase decisions of shoppers say sustainability is important when choosing a brand.
~By comparison, 90% of consumers in the U.S. like chocolate.

5) https://www.foodbeverageinsider.com/confectionery/chocolate-the-preferred-candy-in-america-poll-finds

Brands are adopting eco-friendly packaging and mandating it from converters, encompassing all elements of packaging: base material, adhesives, and inks (i.e., soy-based inks).

The PVH apparel company, a global fashion group (i.e., Calvin Klein, Tommy Hilfiger), converted 74% of its packaging to fully recyclable and aims to reach 100% by 2025.6)

6) https://www.forbes.com/advisor/business/small-business-statistics/

Regulated by legislation such as

The Extended Producer Responsibility (EPR)

The Inflation Reduction Act (IRA)

The U.S. Break Free from Plastic Pollution Act of 2021 (BFFPPA)

01 eCommerce

Green Bay Packaging should deepen collaborations with key suppliers (like Henkel). The goal is to find or co-create innovative material solutions that often must meet conflicting performance requirements in eCommerce packaging. A powerful example is the EPIX® technology portfolio. Learn more here.