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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Fill encapsulants


Epoxy dam and fill encapsulant with excellent handling 

This epoxy adhesive can be used as both a dam or fill encapsulant, and is perfect when you need excellent handling properties. 

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LOCTITE® ECCOBOND EO 1072 is a 1-part, fast curing, epoxy adhesive. It has a unique rheology, which means you can use it as both a dam and fill encapsulant. It has high Tg, low extractable ionics, good shelf life, and is ideal for applications requiring excellent handling properties. 

Coefficient of thermal expansion (CTE), Above Tg:

123.0 ppm/°C

Coefficient of thermal expansion (CTE), Below Tg:

43.0 ppm/°C



Cure schedule, @ 140.0 °C:

5.0 min.

Cure type:

Heat cure

Elongation, at break:

0.9 %

Glass transition temperature (Tg):

135.0 °C

Shelf life:

183.0 day

Shore hardness, Shore D:


Storage temperature:

5.0 °C

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