Fill encapsulants
Epoxy dam and fill encapsulant with excellent handling
This epoxy adhesive can be used as both a dam or fill encapsulant, and is perfect when you need excellent handling properties.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
LOCTITE® ECCOBOND EO 1072 is a 1-part, fast curing, epoxy adhesive. It has a unique rheology, which means you can use it as both a dam and fill encapsulant. It has high Tg, low extractable ionics, good shelf life, and is ideal for applications requiring excellent handling properties.
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High Tg
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Low extractable ionics
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High performance
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Good shelf life
Coefficient of thermal expansion (CTE), Above Tg:
123.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg:
43.0 ppm/°C
Color:
Black
Cure schedule, @ 140.0 °C:
5.0 min.
Cure type:
Heat cure
Elongation, at break:
0.9 %
Glass transition temperature (Tg):
135.0 °C
Shelf life:
183.0 day
Shore hardness, Shore D:
90.0
Storage temperature:
5.0 °C