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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Underfills

LOCTITE® 3508NH

One-part, halogen-free epoxy underfill for shock and drop protection

Halogen-free epoxy underfill for curing during Pb-free solder reflow while allowing self-alignment of IC components.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
2892471

LOCTITE® 3508NH, 30 ml Syringe

Documents

Information

If you’re looking for a reliable underfill to protect electronic products from shock, drop, and vibration, consider LOCTITE® 3508NH. This black, 1-part epoxy-based underfill is designed to cure during Pb-free solder reflow while allowing self-alignment of integrated circuit (IC) components. Ultimately to improve the mechanical reliability of hand-held devices. LOCTITE® 3508NH can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.

  • Product category:
  • Underfills

Technologies:

  • Coefficient of thermal expansion (CTE):
  • 65.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 175.0 ppm/°C

 

  • Glass transition temperature (Tg):
  • 118.0 °C

 

  • Viscosity, cone & plate, @ 25.0 °C:
  • 70000.0 mPa·s (cP)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

                                         

                                           

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