Underfills
One-part, halogen-free epoxy underfill for shock and drop protection
Halogen-free epoxy underfill for curing during Pb-free solder reflow while allowing self-alignment of IC components.
2892471
LOCTITE® 3508NH, 30 ml Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
If you’re looking for a reliable underfill to protect electronic products from shock, drop, and vibration, consider LOCTITE® 3508NH. This black, 1-part epoxy-based underfill is designed to cure during Pb-free solder reflow while allowing self-alignment of integrated circuit (IC) components. Ultimately to improve the mechanical reliability of hand-held devices. LOCTITE® 3508NH can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
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Eliminates post-reflow dispenses
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High reliability and reworkability
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Halogen-free
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Improves mechanical reliability of hand-held devices
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE):
- 65.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 175.0 ppm/°C
- Glass transition temperature (Tg):
- 118.0 °C
- Viscosity, cone & plate, @ 25.0 °C:
- 70000.0 mPa·s (cP)
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Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
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