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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages



One-part, halogen-free epoxy underfill for shock and drop protection

Halogen-free epoxy underfill for curing during Pb-free solder reflow while allowing self-alignment of IC components.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

LOCTITE® 3508NH, 30 ml Syringe



If you’re looking for a reliable underfill to protect electronic products from shock, drop, and vibration, consider LOCTITE® 3508NH. This black, 1-part epoxy-based underfill is designed to cure during Pb-free solder reflow while allowing self-alignment of integrated circuit (IC) components. Ultimately to improve the mechanical reliability of hand-held devices. LOCTITE® 3508NH can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.

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Coefficient of thermal expansion (CTE):

65.0 ppm/°C

Coefficient of thermal expansion (CTE), Above Tg:

175.0 ppm/°C

Glass transition temperature (Tg):

118.0 °C

Viscosity, cone & plate, @ 25.0 °C:

70000.0 mPa·s (cP)

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