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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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As 5G networks scale and the foundations for 6G are laid, broadband connectivity faces mounting demands for ultra-low latency, massive bandwidth, and real-time processing.

Meeting these requirements hinges on cutting-edge semiconductor technologies that can deliver higher compute density, faster data rates, and more efficient signal processing. At the same time, rising power consumption and system costs are intensifying the need for energy-efficient, scalable silicon solutions—placing increasing pressure on semiconductor innovation and profitability.

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Explore applications

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Thermal GAP PAD® materials

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Thermal gels

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Phase change materials

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LIQUI-BOND

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Electrically conductive adhesives

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Thermally conductive adhesives

Related industries

  • An image of a robotic arm holding a chip.

    Semiconductor

    Semiconductors and their novel packaging designs are digitizing our world. From automobiles to data centers, smartphones and 5G infrastructure, semiconductor packaging innovation is at the core of responsive, reliable, robust electronic functionality. That means semiconductors must deliver higher performance, smaller size, unfailing reliability and lower cost.
  • San Francisco city like an electric circuit board

    Data and telecommunications

    In data center, broadband connectivity, and optical networks, increasing speeds need more power, escalating performance-limiting heat and cost. Henkel’s cool, advanced material innovations help dissipate heat at the component level in high performance network applications.

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