Thermally conductive adhesives
Dispensable liquid adhesive for structural component bonding
1-part, silicone liquid adhesive that maintains a solid structural bond and thermal conductivity in severe environment applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
2179541
- Description
- Technical specification
BERGQUIST® LIQUI BOND TLB SA2000 is a high performance, thermally conductive with excellent low- and high-temperature mechanical and chemical stability and replaces the need for mechanical fasteners. The heat curable product is offered in a single-component formulation for easy dispensing and is supplied in either a tube or mid-sized container form. Typical applications include attaching PCBA to housing and discrete component to heat spreader.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
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High thermal conductivity: 2.0 W/m-K
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Excellent mechanical and chemical stability
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Eliminates the need for mechanical fasteners
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One-part formulation for easy dispensing
Color:
Yellow
Flame rating:
V-0
Operating temperature:
-60.0 °C - 200.0 °C
Thermal conductivity:
2.0 W/mK
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