Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically non-conductive adhesives


Electrically non-conductive adhesive for medical device applications 

This epoxy, electrically-insulating adhesive is specially designed for medical device applications. It has medium viscosity, low permeability to gases and vapors, and a low temperature cure.  

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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When you’re working with sensitive applications like catheters, hearing aids, dental products and other biomedical instruments and devices, you need a special kind of non-conductive adhesive. Try LOCTITE® ABLESTIK FDA 2 BIPAX. This medium viscosity adhesive cures in 24 hours at 77°F, after which time it will resist water, weather, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis, as well as other organic and inorganic compounds.  


Medical Device Assembly

Cure schedule, @ 25.0 °C:

24.0 hr.

Cure type:

Heat Cure

Number of components:

2 Part

Operating temperature:

-75.0 °C - 145.0 °C

Recommended for use with:


Shear strength, Aluminum:

1800.0 psi

Storage temperature:

27.0 °C

Thixotropic index:


Viscosity, Brookfield, @ 25.0 °C:

14000.0 mPa·s (cP)

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