LOCTITE® ABLESTIK FDA 2 BIPAX | Henkel Adhesives
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Part no. (SKU/IDH):
1401765

IDH Name:
LOCTITE ABLESTIK FDA 2 BIPAX

Electrically non-conductive adhesives

LOCTITE® ABLESTIK FDA 2 BIPAX

Electrically non-conductive adhesive for medical device applications

This epoxy, electrically-insulating adhesive is specially designed for medical device applications. It has medium viscosity, low permeability to gases and vapors, and a low temperature cure.

Part no. (SKU/IDH):
1401765

IDH Name:
LOCTITE ABLESTIK FDA 2 BIPAX

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® ABLESTIK FDA 2 BIPAX is a medium viscosity, non-conductive adhesive ideal when working with sensitive applications like catheters, hearing aids, dental products, and other biomedical instruments and devices. It cures in 24 hours at 25°C (77°F), after which time it will resist water, weather, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis, as well as other organic and inorganic compounds.

  • Product category:
  • Electrically non-conductive adhesives
  • Applications:
  • Medical device assembly

 

  • Cure schedule, @ 25.0 °C:
  • 24.0 h

 

  • Cure type:
  • Heat cure

 

  • Number of components:
  • 2 part

 

  • Operating temperature:
  • -75.0 °C - 145.0 °C

 

  • Recommended for use with:
  • Metal

 

  • Shear strength, Aluminum:
  • 1800.0 psi

 

  • Storage temperature:
  • 27.0 °C

 

  • Thixotropic index:
  • 1.0

 

  • Viscosity, Brookfield, @ 25.0 °C:
  • 14000.0 mPa·s (cP)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                • Product category:
                                • Electrically non-conductive adhesives

                                Technologies:

                                • Applications:
                                • Medical device assembly
                                • Cure schedule, @ 25.0 °C:
                                • 24.0 h
                                • Cure type:
                                • Heat cure
                                • Number of components:
                                • 2 part
                                • Operating temperature:
                                • -75.0 °C - 145.0 °C
                                • Recommended for use with:
                                • Metal
                                • Shear strength, Aluminum:
                                • 1800.0 psi
                                • Storage temperature:
                                • 27.0 °C
                                • Thixotropic index:
                                • 1.0
                                • Viscosity, Brookfield, @ 25.0 °C:
                                • 14000.0 mPa·s (cP)

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