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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Potting compounds


Thermally conductive, 2-part epoxy encapsulant

Heat-resistant, epoxy-based encapsulant for potting electronic components exposed to harsh environments.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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For a low-CTE epoxy encapsulant that can be used with a variety of catalysts, we recommend LOCTITE® STYCAST 2762FT. This black, room temperature-curing epoxy resin is ideal for potting electronic components exposed to demanding and harsh environments. It's also proven perfect for use on large, complex castings requiring high-temperature resistance and thermal conductivity. LOCTITE® STYCAST 2762FT is a 2-part product fit for use with a variety of LOCTITE® catalysts. We always recommend contacting a local technical service representative for assistance on mixed properties.

Product category:

Potting compounds






Cure type:

Room temperature (ambient) cure

Mixed: Viscosity, Brookfield:

150000.0 mPa·s (cP)

Number of components:

2 part

Please contact us for ordering options

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