Potting compounds
Thermally conductive epoxy encapsulant
This heat-resistant, 2-part epoxy-based encapsulant is perfect for potting electronic components exposed to harsh environments.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® STYCAST 2762FT is a low-CTE epoxy encapsulant that can be used with a variety of catalysts. This black, room-temperature cure epoxy resin is ideal for potting electronic components exposed to demanding and harsh environments. It's also proven perfect for use on large, complex castings requiring high temperature resistance and thermal conductivity. It is a 2-part product fit for use with a variety of LOCTITE catalysts.
-
High thermal conductivity
-
Low coefficient of thermal expansion (CTE)
-
High temperature and chemical resistance
-
Compatible with a variety of LOCTITE catalysts
-
-
- Product category:
- Potting compounds
Technologies:
-
Thermosets, electronics assembly materials
- Applications:
- Encapsulating
- Color:
- Black
- Cure type:
- Room temperature (ambient) cure
- Mixed: Viscosity, Brookfield:
- 150000.0 mPa·s (cP)
- Number of components:
- 2 part
