Part no. (SKU/IDH):
2561420
IDH Name:
LOCTITE® ECCOBOND UF 3831, 30 ml Syringe
Underfills
Halogen-free epoxy underfill
This void-free, reworkable epoxy underfill encapsulant is for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Packages (WLCSPs) production. It is fully RoHS-complaint.
Part no. (SKU/IDH):
2561420
IDH Name:
LOCTITE® ECCOBOND UF 3831, 30 ml Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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Large volume or special order?
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND UF 3831 is a black liquid, halogen-free epoxy encapsulant underfill, for a uniform and void-free layer to protect the active surface of the die of CPS and BGA packages. It is designed to maximize the device's temperature cycling capability, thus distributing stress away from solder interconnects. It is low-CTE and fully compliant with the Restriction of Hazardous Substances Directive (RoHS).
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Halogen-free
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High reworkability
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RoHS compliant
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Void-free
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Color:
- Black
- Number of components:
- 1 part
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{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
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