Henkel Adhesive Technologies

Henkel Adhesive Technologies



One-part, halogen-free, fully RoHS-complaint epoxy underfill

Void-free, reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production.

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For an underfill that performs a uniform and void-free layer to protect the active surface of the die of CPS and BGA packages, give LOCTITE® ECCOBOND UF 3831 a try. This black-liquid, halogen-free epoxy encapsulant is an optimal choice in the production of CSPs, WLCSPs, and BGAs, as it’s designed to maximize the device's temperature cycling capability, thus distributing stress away from solder interconnects. LOCTITE® ECCOBOND UF 3831 is low-CTE and fully compliant with the Restriction of Hazardous Substances Directive (RoHS).

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Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.