Underfills
One-part, halogen-free, fully RoHS-complaint epoxy underfill
Void-free, reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
2561420
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
For an underfill that performs a uniform and void-free layer to protect the active surface of the die of CPS and BGA packages, give LOCTITE® ECCOBOND UF 3831 a try. This black-liquid, halogen-free epoxy encapsulant is an optimal choice in the production of CSPs, WLCSPs, and BGAs, as it’s designed to maximize the device's temperature cycling capability, thus distributing stress away from solder interconnects. LOCTITE® ECCOBOND UF 3831 is low-CTE and fully compliant with the Restriction of Hazardous Substances Directive (RoHS).
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Halogen-free
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High reworkability
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RoHS-compliant
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Void-free
- Product category:
- Underfills
Technologies:
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Thermosets, electronics assembly materials
- Color:
- Black
- Number of components:
- 1 part
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{{#distributor.anyInStock}} In stock {{#distributor.notInStock}} Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
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