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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Underfills

LOCTITE® ECCOBOND UF 3831

One-part, halogen-free, fully RoHS-complaint epoxy underfill

Void-free, reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
2561420

LOCTITE® ECCOBOND UF 3831, 30 ml Syringe

Documents

Information

For an underfill that performs a uniform and void-free layer to protect the active surface of the die of CPS and BGA packages, give LOCTITE® ECCOBOND UF 3831 a try. This black-liquid, halogen-free epoxy encapsulant is an optimal choice in the production of CSPs, WLCSPs, and BGAs, as it’s designed to maximize the device's temperature cycling capability, thus distributing stress away from solder interconnects. LOCTITE® ECCOBOND UF 3831 is low-CTE and fully compliant with the Restriction of Hazardous Substances Directive (RoHS).

Product category:

Underfills

Technologies:

Color:

Black

Number of components:

1 part

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