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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Underfills

LOCTITE® ECCOBOND UF 3831

Halogen-free epoxy underfill

This void-free, reworkable epoxy underfill encapsulant is for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Packages (WLCSPs) production. It is fully RoHS-complaint.

Part no. (SKU/IDH):
2561420

IDH Name:
LOCTITE® ECCOBOND UF 3831, 30 ml Syringe

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® ECCOBOND UF 3831 is a black liquid, halogen-free epoxy encapsulant underfill, for a uniform and void-free layer to protect the active surface of the die of CPS and BGA packages. It is designed to maximize the device's temperature cycling capability, thus distributing stress away from solder interconnects. It is low-CTE and fully compliant with the Restriction of Hazardous Substances Directive (RoHS).

  • Product category:
  • Underfills

Technologies:

  • Color:
  • Black

 

  • Number of components:
  • 1 part

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

                                         

                                           

                                             

                                               

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