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      Part no. (SKU/IDH):
      2310026

      IDH Name:
      LOCTITE® ECCOBOND UF 3812, 55 ml Syringe

      Underfills

      LOCTITE® ECCOBOND UF 3812

      Epoxy underfill with excellent thermal performance

      This 1-part, reworkable epoxy underfill encapsulant is designed for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and Wafer Level Chip Scale Packages (WLCSPs) production. It is compatible with most lead-free solders.

      Technical (1)

      RoHS (1)

      Part no. (SKU/IDH):
      2310026

      IDH Name:
      LOCTITE® ECCOBOND UF 3812, 55 ml Syringe

      All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

      Information

      LOCTITE® ECCOBOND UF 3812 is a halogen-free underfill that shows stable performance under thermal stress. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. It can be used with most Pb-free solders; is designed for the production of BGA, CSP and WLCSPs; and is formulated to flow at room temperature with no additional preheating required.
      • Halogen-free
      • 1-part: no mixing required
      • High reworkability
      • High glass transition temperature (Tg)
      • Product category:
      • Underfills

      Technologies:

      • Thermosets, electronics assembly materials
      • Applications:
      • Encapsulating,Underfilling

       

      • Coefficient of thermal expansion (CTE), Above Tg:
      • 175.0 ppm/°C

       

      • Coefficient of thermal expansion (CTE), Below Tg:
      • 48.0 ppm/°C

       

      • Color:
      • Black

       

      • Cure schedule, @ 130.0 °C:
      • 10.0 min.

       

      • Cure type:
      • Heat cure

       

      • Glass transition temperature (Tg):
      • 131.0 °C

       

      • Pot life:
      • 3.0 day

       

      • Storage modulus, DMA, @ 25.0 °C:
      • 3004.0 N/mm² (435580.0 psi)

       

      • Storage temperature:
      • -20.0 °C

       

      • Viscosity, Physica, @ 25.0 °C:
      • 350.0 mPa·s (cP)

       

      • Work life:
      • 1.0 day

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

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