Henkel Adhesive Technologies

Henkel Adhesive Technologies



One-part epoxy underfill with excellent thermal performance

Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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If you're looking for a halogen-free underfill that shows stable performance under thermal stress, consider LOCTITE® ECCOBOND UF 3812. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. Our ECCOBOND UF 3812 solution can be used with most Pb-free solders; is designed for the production of CSPs, WLCSPs, and BGAs; and is formulated to flow at room temperature with no additional preheating required.



Coefficient of thermal expansion (CTE), Above Tg:

175.0 ppm/°C

Coefficient of thermal expansion (CTE), Below Tg:

48.0 ppm/°C



Cure schedule, @ 130.0 °C:

10.0 min.

Cure type:

Heat Cure

Glass transition temperature (Tg):

131.0 °C

Pot life:

3.0 day

Storage modulus, DMA, @ 25.0 °C:

3004.0 N/mm² (435580.0 psi)

Storage temperature:

-20.0 °C

Viscosity, Physica, @ 25.0 °C:

350.0 mPa·s (cP)

Work life:

1.0 day

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