Encapsulants
Encapsulant for potting stress-sensitive electronic components
This 1-part, low-viscosity fill encapsulant is designed for potting or protecting stress-sensitive electronic components.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND FIL 7010C is a black, low-viscosity fill encapsulant for potting or protecting stress-sensitive electronic components. Due to its low thermal expansion and high Tg, along with a toughened polymer backbone, it is capable of surviving severe thermal shock conditions with a high resistance to microcracking. It's formulated with an epoxy-based resin and cures when exposed to heat. It works under continuous temperatures of 150ºC (302°F) with a peak temperature of 180ºC (365°F).
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Crack- and thermal-resistant
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Good chemical resistance
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High purity
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High glass transition temperature (Tg)
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Service/operating temperature: -40°C to 150°C (-40°F to 302°F)
- Product category:
- Encapsulants
Technologies:
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Thermosets, electronics assembly materials
- Color:
- Black
- Cure type:
- Heat cure
- Number of components:
- 1 part
