Encapsulants
Thermally resistant dam encapsulant for glob top applications
This 1-part, non-sag dam encapsulant is designed for glob tops where protection of wire-bonded bare IC is required.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND DAM 7010C is a black, non-sag dam encapsulant, for use with a fill encapsulant such as LOCTITE® ECCOBOND FIL 7010C, for protecting multiple chips and for encapsulating components that require a well-defined glob height and a flat surface. It’s particularly ideal for glob top applications where protection of wire-bonded bare IC is required. It is formulated with an epoxy-based resin and cures when exposed to heat.
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Crack- and thermal-resistant
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Good chemical resistance
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High purity
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Non-sag
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Service/operating temperature: -40°C to 150°C (-40°F to 302°F)
- Product category:
- Encapsulants
Technologies:
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Thermosets, electronics assembly materials
- Color:
- Black
- Cure type:
- Heat cure
- Number of components:
- 1 part
