Fill encapsulants
No-flow encapsulant for local circuit board protection
This no-flow encapsulant adhesive, designed for local circuit board protection, cures in seconds when exposed to the right intensity of UV light and contains a secondary thermal cure initiator.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND EN 3707 is a no-flow encapsulant for local circuit board protection. It has a fast UV-cure, cures in shadowed areas with heat, and is reworkable. You can also expect good adhesion and easy dispensability without stringing.
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Fast UV cure
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Secondary thermal cure
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Good adhesion
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Reworkable
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- Product category:
- Fill encapsulants
Technologies:
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Thermosets, electronics assembly materials
