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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Fill encapsulants


No-flow encapsulant designed for local circuit board protection 

This no-flow encapsulant adhesive, designed for local circuit board protection, cures in seconds when exposed to the right intensity of UV light and contains a secondary thermal cure initiator. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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When you need a fast cure, no-flow encapsulant for local circuit board protection, try LOCTITE® ECCOBOND EN 3707. It has a fast UV-cure, cures in shadowed areas with heat, and is reworkable. You can also expect good adhesion and easy dispensability without stringing.

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Fill encapsulants


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