Henkel Adhesive Technologies

Henkel Adhesive Technologies

Fill encapsulants

LOCTITE® ECCOBOND 3707

No-flow encapsulant designed for local circuit board protection 

This no-flow encapsulant adhesive, designed for local circuit board protection, cures in seconds when exposed to the right intensity of UV light and contains a secondary thermal cure initiator. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options

Documents

Information

When you need a fast cure, no-flow encapsulant for local circuit board protection, try LOCTITE® ECCOBOND EN 3707. It has a fast UV-cure, cures in shadowed areas with heat, and is reworkable. You can also expect good adhesion and easy dispensability without stringing.

Please contact us for ordering options

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.