Fill encapsulants
No-flow encapsulant designed for local circuit board protection
This no-flow encapsulant adhesive, designed for local circuit board protection, cures in seconds when exposed to the right intensity of UV light and contains a secondary thermal cure initiator.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
When you need a fast cure, no-flow encapsulant for local circuit board protection, try LOCTITE® ECCOBOND EN 3707. It has a fast UV-cure, cures in shadowed areas with heat, and is reworkable. You can also expect good adhesion and easy dispensability without stringing.
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Fast UV cure
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Secondary thermal cure
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Good adhesion
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Reworkable
- Product category:
- Fill encapsulants
Technologies:
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Thermosets, electronics assembly materials
