Henkel Adhesive Technologies

Henkel Adhesive Technologies

Underfills

LOCTITE® 3517M

One-part, black epoxy underfill for preventing mechanical stress

One-part, reworkable epoxy underfill for CSP and BGA production.

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Documents

Information

If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.

Coefficient of thermal expansion (CTE):

65.0 ppm/°C

Coefficient of thermal expansion (CTE), Above Tg:

191.0 ppm/°C

Cure schedule light intensity:

30.0 mW/cm²

Cure schedule, Recommended, @ 120.0 °C:

5.0 min.

Glass transition temperature (Tg):

78.0 °C

Viscosity, Haake PK1.2:

2600.0 mPa·s (cP)

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Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.