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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Part no. (SKU/IDH):
1658529

IDH Name:
LOCTITE® 3517M, 30 ml Syringe

Underfills

LOCTITE® 3517M

Black epoxy underfill for preventing mechanical stress

Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).

Part no. (SKU/IDH):
1658529

IDH Name:
LOCTITE® 3517M, 30 ml Syringe

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® 3517M is a reliable, black liquid, epoxy-based underfill solution designed for the production of BGA and CSP. It's ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.

  • Product category:
  • Underfills

Technologies:

  • Coefficient of thermal expansion (CTE):
  • 65.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 191.0 ppm/°C

 

  • Cure schedule light intensity:
  • 30.0 mW/cm²

 

  • Cure schedule, Recommended, @ 120.0 °C:
  • 5.0 min.

 

  • Glass transition temperature (Tg):
  • 78.0 °C

 

  • Viscosity, Haake PK1.2:
  • 2600.0 mPa·s (cP)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

                                     

                                       

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