Part no. (SKU/IDH):
1658529
IDH Name:
LOCTITE® 3517M, 30 ml Syringe
Underfills
Black epoxy underfill for preventing mechanical stress
Reworkable 1-part epoxy underfill for Ball Grid Array (BGA) and Chip Scale Packaging (CSP).
Part no. (SKU/IDH):
1658529
IDH Name:
LOCTITE® 3517M, 30 ml Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} In stock {{#distributor.notInStock}} Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
{{/distributor.isExpanded}}
{{^distributor.isExpanded}}
{{/distributor.isExpanded}}
{{/distributor.isVisible}}
{{/data}}
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® 3517M is a reliable, black liquid, epoxy-based underfill solution designed for the production of BGA and CSP. It's ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
-
High reliability and reworkability
-
1 part: no mixing required
-
Low halogen
-
7-day pot life at 22°C (71.6°F)
- Product category:
- Underfills
Technologies:
-
Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE):
- 65.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 191.0 ppm/°C
- Cure schedule light intensity:
- 30.0 mW/cm²
- Cure schedule, Recommended, @ 120.0 °C:
- 5.0 min.
- Glass transition temperature (Tg):
- 78.0 °C
- Viscosity, Haake PK1.2:
- 2600.0 mPa·s (cP)
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} In stock {{#distributor.notInStock}} Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
{{/distributor.isExpanded}}
{{^distributor.isExpanded}}
{{/distributor.isExpanded}}
{{/distributor.isVisible}}
{{/data}}