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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal SIL PAD Materials

BERGQUIST® SIL PAD TSP K900

Electrically insulating, polyimide reinforced pad - cost effective

Thermally conductive, polyimide-reinforced insulator pad for excellent voltage breakdown and dielectric strength. Very durable, low thermal impedance.

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Information

BERGQUIST® SIL PAD TSP K900 is a silicone-Kapton reinforced insulator. This product combines the thermal transfer properties of Sil-pad with high dielectric strength and physically tough Kapton. It is a highly durable product, which withstands high voltages.

Dielectric breakdown voltage:

6000.0 Vac

Dielectric constant, @ 1kHz:

5.0

Flame rating:

V-0

Operating temperature:

-60.0 °C - 180.0 °C

Shore hardness, ASTM D2240, Shore A:

90.0

Standard thickness:

0.152 mm

Thermal conductivity:

0.9 W/mK

Thermal impedance, ASTM D5470, @ 50 psi:

0.48 °C-in²/W

Volume resistivity:

1×10 Ohm m

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