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Henkel Adhesive Technologies

Henkel Adhesive Technologies

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Part no. (SKU/IDH):
2190088

IDH Name:
BERGQUIST® SIL PAD® TSP K900

Thermal SIL PAD Materials

BERGQUIST® SIL PAD® TSP K900

Electrically insulating, polyimide-reinforced pad - cost effective

This thermally conductive, polyimide-reinforced insulator pad is designed for excellent voltage breakdown and dielectric strength. Very durable, low thermal impedance.

Marketing materials

Part no. (SKU/IDH):
2190088

IDH Name:
BERGQUIST® SIL PAD® TSP K900

WARNING!

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

BERGQUIST® SIL PAD® TSP K900 is a silicone-Kapton® reinforced insulator. This product combines the thermal transfer properties of Sil-Pad® with high dielectric strength and physically tough Kapton®. It is a highly durable product, which withstands high voltages.

  • Product category:
  • Thermal SIL PAD Materials

Technologies:

  • Dielectric breakdown voltage:
  • 6000.0 Vac

 

  • Dielectric constant, @ 1kHz:
  • 5.0

 

  • Flame rating:
  • V-0

 

  • Operating temperature:
  • -60.0 °C - 180.0 °C

 

  • Shore hardness, ASTM D2240, Shore A:
  • 90.0

 

  • Standard thickness:
  • 0.152 mm

 

  • Thermal conductivity:
  • 0.9 W/mK

 

  • Thermal impedance, ASTM D5470, @ 50 psi:
  • 0.48 °C-in²/W

 

  • Volume resistivity:
  • 1×10 Ohm m

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

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