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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal SIL PAD Materials


Electrically insulating, polyimide reinforced pad - high performance

Thermally conductive, polyimide-reinforced insulator pad, designed to replace fragile and expensive ceramic insulators. Good cut-through.

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BERGQUIST® SIL PAD TSP K1300 is a high-performance material developed in conjunction with DuPont. By combining a special Kapton MT Polyimide film with boron nitride filled silicone rubber, this product exhibits high performance and good cut-through characteristics. It is a durable material, which can be used as a replacement for fragile and expensive ceramic insulators. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

Carrier type:




Operating temperature:

-60.0 °C - 180.0 °C

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