Thermal SIL PAD Materials
Electrically insulating pad - high performance
Thermally conductive, silicone insulator pad for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® SIL PAD TSP 3500 is a thermally-conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Thermal impedance: 0.33°C (32.6°F) -in2/W at 50 psi
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High thermal conductivity 3.5 W/m-K
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Optimal heat transfer
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Easy to use and rework
- Product category:
- Thermal SIL PAD Materials
Technologies:
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Thermal management, circuits and substrates
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Thermal management, sil pads
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Specialties, others
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Thermal management, silicone pads
- Carrier type:
- Fiberglass
- Color:
- White
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 200.0 °C
- Standard thickness:
- 0.254 mm - 0.508 mm
- Thermal conductivity:
- 3.5 W/mK
