Thermal SIL PAD Materials
Electrically insulating pad - high performance
This thermally conductive, silicone insulator pad is designed for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
Marketing materials
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® SIL PAD® TSP 3500 is a thermally conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease-free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics.
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Thermal impedance: 0.33°C (32.6°F) -in2/W at 50 psi
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High thermal conductivity 3.5 W/m-K
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Optimal heat transfer
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Easy to use and rework
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermal SIL PAD Materials
Technologies:
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Thermal management, circuits and substrates
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Thermal management, sil pads
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Specialties, others
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Thermal management, silicone pads
- Carrier type:
- Fiberglass
- Color:
- White
- Flame rating:
- V-0
- Operating temperature:
- -60.0 °C - 200.0 °C
- Standard thickness:
- 0.254 mm - 0.508 mm
- Thermal conductivity:
- 3.5 W/mK
