Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Thermal SIL PAD Materials

BERGQUIST® SIL PAD® TSP 3500

Electrically insulating pad - high performance

Thermally conductive, silicone insulator pad for demanding aerospace and commercial applications. High cut-through, low thermal impedance.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options

Documents

Information

 BERGQUIST® SIL PAD TSP 3500 is a thermally-conductive, insulating, rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass, providing high reliability for electronic packaging applications. Typical applications include power supplies, motor controls, power semiconductors, aerospace, and avionics. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

Product category:

Thermal SIL PAD Materials

Technologies:

Carrier type:

Fiberglass

Color:

White

Flame rating:

V-0

Operating temperature:

-60.0 °C - 200.0 °C

Standard thickness:

0.254 mm - 0.508 mm

Thermal conductivity:

3.5 W/mK

Related industries and market segments

Please contact us for ordering options

There are some errors, please correct them below.

Recently viewed products

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.