Thermal SIL PAD Materials
Electrically insulating pad - high performance
Thermally conductive, silicone insulator pad for demanding aerospace and commercial applications. High cut-through, low thermal impedance.
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- Technical specification
BERGQUIST® SIL PAD TSP 3500 is a thermally conductive insulating rigid, pre-cured pad used between heat sink or metal housing and components. It is formulated to maximize both the thermal and dielectric performance of the filler/binder matrix. The conformable material is grease free and reinforced with fiberglass providing high reliability for electronic packaging applications. Typical applications include, power supplies, motor controls, power semiconductors, aerospace, and avionics.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
-60.0 °C - 200.0 °C
0.254 mm - 0.508 mm