Part no. (SKU/IDH):
2198387
IDH Name:
BERGQUIST® HI FLOW THF 3000UT, 4″x4″ dimension, 0.005″ thickness
Phase change materials
Easy-to-use tabulated pad
This naturally tacky, unreinforced, thermally conductive phase change material is designed for electronic power devices, such as a processor lid or die to a heat sink. No spill, no mess, high reliability.
Marketing materials
Part no. (SKU/IDH):
2198387
IDH Name:
BERGQUIST® HI FLOW THF 3000UT, 4″x4″ dimension, 0.005″ thickness
Thickness Please make your selection 0.005″
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® HI FLOW THF 3000UT is a thermally conductive, 52°C (125.6°F) phase change material that comes in a tabulated pad form for ease of assembly. This product is designed with a phase change softening feature for improved handling prior to assembly. Very low thermal impedance is produced by wetting out the thermal interfaces at application temperatures and pressures. It is comparable to the best thermal greases and the consistent thickness ensures reliable performance without the pump-out often experienced with some thermal greases. Can be applied using low pressure roller or manual applications.
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Thermal conductivity: 3.0 W/m-K
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Naturally tacky and tabulated for ease of assembly
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Phase change softening temp 52°C (125°F)
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Thermal impedance: 0.05°C (32°F) -in2/W at 25 psi
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Phase change materials
Technologies:
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Thermal management, speciality pads
- Color:
- Blue
- Flame rating:
- V-0
- Operating temperature:
- 125.0 °C
- Standard thickness:
- 0.127 mm - 0.254 mm
- Thermal conductivity:
- 3.0 W/mK
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Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
