Encapsulants
Epoxy encapsulant for protecting bare semiconductor devices
Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND FP4450 encapsulant is designed for protecting bare semiconductor devices. It is low stress, high purity, and offers good moisture resistance. You can also rely on pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.
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Low stress
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Good moisture resistance
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High purity
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Quite high flow
- Product category:
- Encapsulants
Technologies:
-
Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Below Tg:
- 22.0 ppm/°C
- Color:
- Black
- Cure schedule, Alternate, @ 165.0 °C:
- 90.0 min.
- Cure schedule, Recommended, @ 125.0 °C:
- 30.0 min.
- Cure type:
- Heat cure
- Filler:
- 73.0 %
- Glass transition temperature (Tg):
- 155.0 °C
- Operating temperature:
- -65.0 °C - 150.0 °C
- Specific gravity, @ 25.0 °C:
- 1.77
- Storage temperature:
- -40.0 °C
- Viscosity, Brookfield - RVT, @ 25.0 °C:
- 43900.0 mPa·s (cP)
