Electrically non-conductive adhesives
Non-conductive die-attach adhesive for integrated circuits
This 1-part, non-conductive die-attach adhesive is used for attaching integrated circuits and components to advanced substrates.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK QMI536 is a white non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates, including plastic ball grid arrays (PBGA), chip scale packages (CSP), array packages, and stacked die. It’s formulated with a fluoropolymer-filled bismaleimide resin and cures when exposed to heat. It produces a void-free bondline with excellent interfacial strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. It can be cured in a conventional oven, on a snap-cure oven, or by utilizing SkipCure™ processing on a die or wire bonder. It’s designed to produce cure onset below 100°C (212°F). This can reduce or eliminate the need to pre-dry organic substrates before the die-attach process.
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Void-free bondline
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Compatible with advanced substrates
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Hydrophobic
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Exhibits excellent dielectric properties
- Product category:
- Die attach adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Application method:
- Dispense system
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 98.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 174.0 ppm/°C
- Color:
- White
- Cure type:
- Heat cure
- Density, Maximum Final:
- 1.3 g/cm³
- Extractable ionic content, Chloride (CI-):
- 20.0 ppm
- Extractable ionic content, Fluoride (F-):
- 20.0 ppm
- Extractable ionic content, Potassium (K+):
- 20.0 ppm
- Extractable ionic content, Sodium (Na+):
- 20.0 ppm
- Glass transition temperature (Tg):
- -31.0 °C
- Key characteristics:
- Adhesion: good adhesion; Alpha emissions: ultra low alpha emissions; Cure speed: very fast; Dielectric; Dispensibility: good dispensibility; Lead free process compatible; Modulus: low modulus; Stress: low stress
- Modulus, DMA, @ 25.0 °C:
- 0.3 GPa (300.0 N/mm², 43500.0 psi)
- Number of components:
- 1 part
- Physical form:
- Paste
- RT die shear strength, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe:
- 17.0 kg-f
- Recommended for use with:
- Laminate; Polyimide
- Thermal conductivity:
- 0.3 W/mK
- Thixotropic index:
- 5.7
- Viscosity:
- 8500.0 mPa·s (cP)
