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      Part no. (SKU/IDH):
      632815

      IDH Name:
      LOCTITE® ABLESTIK QMI536, 30 cc Syringe

      Electrically non-conductive adhesives

      LOCTITE® ABLESTIK QMI536

      Non-conductive die-attach adhesive for integrated circuits

      This 1-part, non-conductive die-attach adhesive is used for attaching integrated circuits and components to advanced substrates.

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      RoHS (1)

      Regulatory (1)

      Part no. (SKU/IDH):
      632815

      IDH Name:
      LOCTITE® ABLESTIK QMI536, 30 cc Syringe

      All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

      Information

      LOCTITE® ABLESTIK QMI536 is a white non-conductive die-attach adhesive for attaching integrated circuits and components to advanced substrates, including plastic ball grid arrays (PBGA), chip scale packages (CSP), array packages, and stacked die. It’s formulated with a fluoropolymer-filled bismaleimide resin and cures when exposed to heat. It produces a void-free bondline with excellent interfacial strength to various organic and metal surfaces, including solder masks, BT, FR, polyimide, and Au. It can be cured in a conventional oven, on a snap-cure oven, or by utilizing SkipCure™ processing on a die or wire bonder. It’s designed to produce cure onset below 100°C (212°F). This can reduce or eliminate the need to pre-dry organic substrates before the die-attach process.
      • Void-free bondline
      • Compatible with advanced substrates
      • Hydrophobic
      • Exhibits excellent dielectric properties
      • Product category:
      • Die attach adhesives

      Technologies:

      • Thermosets, electronics semiconductor materials
      • Application method:
      • Dispense system

       

      • Applications:
      • Die attach

       

      • Coefficient of thermal expansion (CTE):
      • 98.0 ppm/°C

       

      • Coefficient of thermal expansion (CTE), Above Tg:
      • 174.0 ppm/°C

       

      • Color:
      • White

       

      • Cure type:
      • Heat cure

       

      • Density, Maximum Final:
      • 1.3 g/cm³

       

      • Extractable ionic content, Chloride (CI-):
      • 20.0 ppm

       

      • Extractable ionic content, Fluoride (F-):
      • 20.0 ppm

       

      • Extractable ionic content, Potassium (K+):
      • 20.0 ppm

       

      • Extractable ionic content, Sodium (Na+):
      • 20.0 ppm

       

      • Glass transition temperature (Tg):
      • -31.0 °C

       

      • Key characteristics:
      • Adhesion: good adhesion; Alpha emissions: ultra low alpha emissions; Cure speed: very fast; Dielectric; Dispensibility: good dispensibility; Lead free process compatible; Modulus: low modulus; Stress: low stress

       

      • Modulus, DMA, @ 25.0 °C:
      • 0.3 GPa (300.0 N/mm², 43500.0 psi)

       

      • Number of components:
      • 1 part

       

      • Physical form:
      • Paste

       

      • RT die shear strength, 7.6 x 7.6 mm Si die on Ag plated Cu leadframe:
      • 17.0 kg-f

       

      • Recommended for use with:
      • Laminate; Polyimide

       

      • Thermal conductivity:
      • 0.3 W/mK

       

      • Thixotropic index:
      • 5.7

       

      • Viscosity:
      • 8500.0 mPa·s (cP)

       

         

           

             

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