Electrically non-conductive adhesives
Dual-cure electrically non-conductive adhesive for electronic components
This epoxy, electrically non-conductive adhesive is designed for assembling temperature-sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is perfect for use in the assembly of temperature-sensitive electronic components. It has good flow performance, excellent adhesion, and is formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. This means you can make any necessary adjustments to the final device configuration before committing it to full cure.
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UV curable
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Good flow performance
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Excellent adhesion
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High Tg
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- Product category:
- Electrically non-conductive adhesives
Technologies:
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Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE):
- 56.0 ppm/°C
- Coefficient of thermal expansion (CTE), Above Tg:
- 183.0 ppm/°C
- Cure type:
- Heat + UV cure
- Glass transition temperature (Tg):
- 95.0 °C
- Storage modulus:
- 3.0 GPa
- Thixotropic index:
- 2.4
- Viscosity, Shear Rate 10 s⁻¹:
- 35000.0 mPa·s (cP)
