Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically non-conductive adhesives


Dual cure, electrically non-conductive adhesive for electronic components 

This epoxy electrically non-conductive adhesive is designed for assembling temperature sensitive electronic components. An initial temporary cure allows for adjustments to the final device configuration. 

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LOCTITE® ABLESTIK NCA 2380 dual cure adhesive is perfect for use in the assembly of temperature sensitive electronic components. It has good flow performance, excellent adhesion, and is formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. This means you can make any necessary adjustments to the final device configuration before committing it to full cure. 

Coefficient of thermal expansion (CTE):

56.0 ppm/°C

Coefficient of thermal expansion (CTE), Above Tg:

183.0 ppm/°C

Cure type:

Heat + UV Cure

Glass transition temperature (Tg):

95.0 °C

Storage modulus:

3.0 GPa

Thixotropic index:


Viscosity, Shear Rate 10 s⁻¹:

35000.0 mPa·s (cP)

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