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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Electrically non-conductive adhesives


Dual-cure non-conductive adhesive for temperature sensitive electronic parts

This high viscosity, thixotropic electrically non-conductive adhesive is specially designed for use in the assembly of temperature sensitive electronic components. It has a dual cure to allow for adjustments.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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LOCTITE® ABLESTIK NCA 2280 is specially designed for use in the assembly of temperature sensitive electronic components, and has been formulated to temporarily cure when exposed to UV light, followed by a secondary thermal cure at low temperature. Temporarily curing the material gives you the freedom to make any necessary adjustments to the final device configuration (the product’s high viscosity and thixotropy also help). It is black in color to prevent light penetration into the final assembled device.

Product category:

Electrically non-conductive adhesives


Cure schedule light intensity:

100.0 mW/cm²

Cure schedule, Recommended:

2.0 sec.

Cure type:

Heat cure

Number of components:

1 part

Recommended for use with:


Shear strength:

2900.0 psi

Storage temperature:

-20.0 °C

Thixotropic index:


Viscosity, cone & plate, Cone 20 mm, Angle 2°, @ 25.0 °C:

54000.0 mPa·s (cP)

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