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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Electrically conductive adhesives


Electrically conductive adhesive with a low-temperature cure

Electrically conductive epoxy adhesive for stable contact resistance and a low-temperature cure. Offers a more secure electrical interconnection than traditional soldering.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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This electrically conductive epoxy adhesive is a great lead-free alternative to solder, has stable contact resistance on non-noble terminated (Sn, SnPb, Ni, etc) components and substrates, and passes NASA outgassing standards, making it a great adhesive for all types of component assembly.

Product category:

Electrically conductive adhesives


Application method:

Dispense gun

Cure schedule, @ 120.0 °C:

10.0 min.

Cure type:

Heat cure

Number of components:

1 part

Operating temperature:

150.0 °C

Physical form:


Recommended for use with:

Metal: tin

Shear strength:

1890.0 psi

Storage temperature:

-40.0 °C - -35.0 °C

Thixotropic index:


Viscosity, Plate 2 cm, @ 25.0 °C:

20000.0 mPa·s (cP)

Volume resistivity:

0.0008 Ohm cm

Please contact us for ordering options

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