Electrically conductive adhesives
Electrically conductive adhesive with a low-temperature cure
Electrically conductive epoxy adhesive for stable contact resistance and a low-temperature cure. Offers a more secure electrical interconnection than traditional soldering.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
This electrically conductive epoxy adhesive is a great lead-free alternative to solder, has stable contact resistance on non-noble terminated (Sn, SnPb, Ni, etc) components and substrates, and passes NASA outgassing standards, making it a great adhesive for all types of component assembly.
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Electrically conductive
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Low cure temperature
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Pb-free alternative to solder
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Stable contact resistance
Application method:
Dispense gun
Cure schedule, @ 120.0 °C:
10.0 min.
Cure type:
Heat cure
Number of components:
1 part
Operating temperature:
150.0 °C
Physical form:
Paste
Recommended for use with:
Metal: tin
Shear strength:
1890.0 psi
Storage temperature:
-40.0 °C - -35.0 °C
Thixotropic index:
5.5
Viscosity, Plate 2 cm, @ 25.0 °C:
20000.0 mPa·s (cP)
Volume resistivity:
0.0008 Ohm cm