Part no. (SKU/IDH):
1189522
IDH Name:
LOCTITE® ABLESTIK CE 3103WLV, Standard Cartridge
Electrically conductive adhesives
Electrically conductive adhesive with a low-temperature cure
A 1-part, electrically conductive epoxy adhesive for stable contact resistance and a low-temperature cure. Offers a more secure electrical interconnection than traditional soldering.
Part no. (SKU/IDH):
1189522
IDH Name:
LOCTITE® ABLESTIK CE 3103WLV, Standard Cartridge
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
- Question & answer
LOCTITE® ABLESTIK CE 3103WLV is a great lead-free alternative to solder, has stable contact resistance on non-noble terminated (Sn, SnPb, Ni, etc) components and substrates, and passes NASA outgassing standards, making it a great adhesive for all types of component assembly.
-
Electrically conductive
-
Low cure temperature
-
Pb-free alternative to solder
-
Stable contact resistance
- Product category:
- Electrically conductive adhesives
Technologies:
-
Electronics assembly materials
- Application method:
- Dispense gun
- Cure schedule, @ 120.0 °C:
- 10.0 min
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Operating temperature:
- 150.0 °C
- Physical form:
- Paste
- Recommended for use with:
- Metal: tin
- Shear strength:
- 1890.0 psi
- Storage temperature:
- -40.0 °C - -35.0 °C
- Thixotropic index:
- 5.5
- Viscosity, Plate 2 cm, @ 25.0 °C:
- 20000.0 mPa·s (cP)
- Volume resistivity:
- 0.0008 Ohm cm
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
Our experts are here to learn more about your needs.
Our support center and experts are ready to help you find solutions for your business needs.