Part no. (SKU/IDH):
1679236
IDH Name:
LOCTITE® ABLESTIK 8700E, Syringe
Electrically conductive adhesives
Thermally and electrically conductive adhesive for hybrid component attach
A 1-part, epoxy-based, thermally and electrically conductive adhesive designed for hybrid component attach.
Part no. (SKU/IDH):
1679236
IDH Name:
LOCTITE® ABLESTIK 8700E, Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} In stock {{#distributor.notInStock}} Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
{{/distributor.isExpanded}}
{{^distributor.isExpanded}}
{{/distributor.isExpanded}}
{{/distributor.isVisible}}
{{/data}}
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK 8700E is a silver, thermally and electrically conductive adhesive is designed for hybrid component attach. It’s particularly ideal for gold and gold-plated surfaces and offers excellent dispensing and printing characteristics with no tailing or peaking. It’s formulated with an epoxy-based resin and cures when exposed to heat.
-
Compatible with gold and gold-plated surfaces
-
Offers excellent dispensability
-
Retains high shear strength after thermal cycling
-
No tailing or peaking
- Product category:
- Electrically conductive adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Cure schedule, @ 160.0 °C:
- 2.0 hr.
- Cure type:
- Heat cure
- Number of components:
- 1 part
- Storage temperature:
- -40.0 °C
- Thixotropic index:
- 3.0
- Viscosity, Brookfield CP51, @ 25.0 °C:
- 18000.0 mPa·s (cP)
- Volume resistivity:
- 0.0002 Ohm cm
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} In stock {{#distributor.notInStock}} Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly. You will receive an email notification when product is back in stock.You will not receive an email notification when product is back in stock.
{{/distributor.isExpanded}}
{{^distributor.isExpanded}}
{{/distributor.isExpanded}}
{{/distributor.isVisible}}
{{/data}}