Die attach adhesives
Die-attach adhesive for high-reliability package applications
This acrylate-based, thermally and electrically conductive die-attach adhesive is designed for high-reliability packaging.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK 8600 is a silver die-attach adhesive for high-reliability package applications with medium thermal and electrical requirements. It’s compatible with Ag, PPF and Cu, but not recommended for high-density matrix lead frames with more than 500 pads. It’s formulated with an acrylate-based resin, offers low bleed and cures snappy when exposed to heat.
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Compatible with Ag, PPF and Cu
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Improved JEDEC performance
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Offers low bleed
- Product category:
- Die attach adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 46.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 9.0 ppm
- Extractable ionic content, Potassium (K+):
- 9.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- RT die shear strength:
- 11.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 2200.0 N/mm² (325000.0 psi)
