Die attach adhesives
Conductive die-attach adhesive for high-throughput applications
This epoxy-based, thermally and electrically conductive die-attach adhesive is designed for high-throughput applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK 8390 is a silver, thermally and electrically conductive die-attach adhesive for high-throughput applications. It’s compatible with silver-plated and palladium-plated copper lead frames and silver-plated alloy 42 lead frames and as suitable for die sizes up to 8 mm x 8 mm (0.31" x 0.31"). It demonstrates excellent dispensability with minimal tailing and stringing, and minimal resin bleed. It’s formulated with an epoxy-based resin and cures when exposed to heat.
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Suitable for die sizes up to 8 mm x 8 mm (0.31 x 0.31")
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Compatible with palladium
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Offers excellent dispensability
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In-line oven snap cure
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Low condensable volatiles
- Product category:
- Die attach adhesives
Technologies:
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Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 60.0 ppm/°C
- Color:
- Silver
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 19.0 ppm
- Extractable ionic content, Potassium (K+):
- 4.0 ppm
- Extractable ionic content, Sodium (Na+):
- 9.0 ppm
- Key characteristics:
- Dispensibility: good dispensibility
- RT die shear strength, 2 x 2 mm Si die on Ag/Cu leadframe:
- 11.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 517.0 N/mm² (75000.0 psi)
