Die attach adhesives
Electrically conductive die-attach adhesive for lead frame packaging
This epoxy-based, electrically conductive die-attach adhesive is specially designed for high-reliability lead frame packaging applications.
Marketing materials
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ABLESTIK 8290 is a silver, electrically conductive die-attach adhesive for high-reliability leadframe packaging applications, recommended for die sizes up to 200 mm (7.87") for the best MRT performance. It’s formulated with an epoxy-based resin, cures when exposed to heat and demonstrates low stress and low bleed.
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Improved JEDEC performance
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Low stress and low bleed
- Product category:
- Die attach adhesives
Technologies:
-
Thermosets, electronics semiconductor materials
- Applications:
- Die attach
- Coefficient of thermal expansion (CTE):
- 81.0 ppm/°C
- Cure type:
- Heat cure
- Extractable ionic content, Chloride (CI-):
- 29.0 ppm
- Extractable ionic content, Potassium (K+):
- 19.0 ppm
- Extractable ionic content, Sodium (Na+):
- 19.0 ppm
- RT die shear strength:
- 15.0 kg-f
- Tensile modulus, @ 250.0 °C:
- 117.0 N/mm² (17000.0 psi)
