Film adhesives
Film adhesive for bonding materials with severely mismatched CTE
This adhesive film is designed for substrate attach and heat sink bonding, and is ideal for bonding materials with severely mismatched coefficients of thermal expansion.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
When you’re working with applications where CTE mismatch is an issue, try LOCTITE® ABLESTIK 561K. This film adhesive is electrically insulating, high strength, and specially designed for substrate attach and heat sink bonding – especially when materials are severely mismatched in terms of coefficients of thermal expansion. Please note data and results will vary with different thicknesses.
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Flexible for bonding mismatched adherents
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Reworkable
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Thermally conductive
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Electrically insulating film
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Manages applications where CTE mismatch is an issue
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High strength
- Product category:
- Film adhesives
Technologies:
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Thermosets, electronics assembly materials
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Thermosets, film
- Carrier type:
- Glass fabric
- Cure schedule, @ 150.0 °C:
- 30.0 min.
- Cure type:
- Heat cure
- Dielectric constant, @ 1kHz:
- 5.7
- Glass transition temperature (Tg):
- 55.0 °C
- Physical form:
- Film
- Shear strength, Aluminum:
- 3300.0 psi
- Thermal conductivity:
- 0.9 W/mK
