Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Surface mount adhesives


Very high dispense speed, electrically non-conductive surface mount adhesive

Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)

LOCTITE® 3621, 10 ml Syringe



When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.

Product category:

Surface mount adhesives


Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C:

0.5 Pa∙s - 3.0 Pa∙s

Coefficient of thermal expansion (CTE), Above Tg:

100.0 ppm/°C

Cure schedule, @ 150.0 °C:

90.0 sec. - 120.0 sec.

Cure type:

Heat cure

Number of components:

1 part

Physical form:


Shear strength, Steel (grit blasted):

2175.0 psi

Storage temperature:

2.0 °C - 8.0 °C

Yield point, cone & plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C:

130.0 Pa∙s - 280.0 Pa∙s

Recently viewed products

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.