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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Surface mount adhesives

LOCTITE® 3621

Very high dispense speed, electrically non-conductive surface mount adhesive

Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
235130

LOCTITE® 3621, 10 ml Syringe

Documents

Information

When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.

Product category:

Surface mount adhesives

Technologies:

Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C:

0.5 Pa∙s - 3.0 Pa∙s

Coefficient of thermal expansion (CTE), Above Tg:

100.0 ppm/°C

Cure schedule, @ 150.0 °C:

90.0 sec. - 120.0 sec.

Cure type:

Heat cure

Number of components:

1 part

Physical form:

Gel

Shear strength, Steel (grit blasted):

2175.0 psi

Storage temperature:

2.0 °C - 8.0 °C

Yield point, cone & plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C:

130.0 Pa∙s - 280.0 Pa∙s

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