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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Surface mount adhesives

LOCTITE® 3621

Very high dispense speed, electrically non-conductive surface mount adhesive

Electrically non-conductive adhesive for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Part no. (SKU/IDH)
235130

LOCTITE® 3621, 10 ml Syringe

Documents

Information

When you need a surface mount adhesive with very high dispense speed, try LOCTITE® 3621. It is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.

  • Product category:
  • Surface mount adhesives

Technologies:

  • Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C:
  • 0.5 Pa∙s - 3.0 Pa∙s

 

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 100.0 ppm/°C

 

  • Cure schedule, @ 150.0 °C:
  • 90.0 sec. - 120.0 sec.

 

  • Cure type:
  • Heat cure

 

  • Number of components:
  • 1 part

 

  • Physical form:
  • Gel

 

  • Shear strength, Steel (grit blasted):
  • 2175.0 psi

 

  • Storage temperature:
  • 2.0 °C - 8.0 °C

 

  • Yield point, cone & plate, Haake PK100, M10/PK1, 2°, @ 25.0 °C:
  • 130.0 Pa∙s - 280.0 Pa∙s

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

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