Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

Technomelt Technology Cluster Brand for Product Detail Pages

Injection molding compounds


Polyamide hotmelt for low-pressure molding applications 

This high performance, thermoplastic polyamide hotmelt is designed to meet low pressure molding process requirements, so it will encapsulate fragile components without damaging them. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options



When you’re working with fragile components, you need a low viscosity hotmelt. TECHNOMELT® PA 678 high performance thermoplastic polyamide can be injected at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. It produces no toxic fumes, provides a good balance of low and high temperature performance, and has excellent moisture and environmental resistance. You can also expect easy moldability and good adhesion to a variety of substrates.  

Product category:





Elongation, at break:

400.0 %

Recommended for use with:


Softening point temperature:

140.0 °C - 150.0 °C

Related industries and market segments

Please contact us for ordering options

There are some errors, please correct them below.

Recently viewed products

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.