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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages



Halogen free, low viscosity, reworkable underfill 

This halogen free, reworkable, low-viscosity underfill encapsulant is specially formulated to flow at room temperature: no additional preheating required. 

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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LOCTITE® ECCOBOND UF 3811 is a reworkable, low-viscosity epoxy underfill specially designed for CSP and BGA applications. It flows at room temperature with no additional preheating required, and cures quickly at moderate temperatures to minimize stress to other components. When cured, it has a high glass transition temperature while maintaining flexibility, so solder joints are protected during thermal cycling and drop testing. 

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Coefficient of thermal expansion (CTE), Above Tg:

190.0 ppm/°C

Coefficient of thermal expansion (CTE), Below Tg:

61.0 ppm/°C

Cure schedule, @ 100.0 °C:

60.0 min.

Glass transition temperature (Tg):

124.0 °C

Viscosity, Brookfield, Physica, @ 25.0 °C:

354.0 mPa·s (cP)

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