Henkel Adhesive Technologies

Henkel Adhesive Technologies

Encapsulants

LOCTITE® ECCOBOND FP4450

Epoxy encapsulant for protecting bare semiconductor devices 

Choose this epoxy encapsulant for pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type.  

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Please contact us for ordering options

Information

LOCTITE® ECCOBOND FP4450 encapsulant is designed for protecting bare semiconductor devices. It is low stress, high purity, and offers good moisture resistance. You can also rely on pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control. 

Coefficient of thermal expansion (CTE), Below Tg:

22.0 ppm/°C

Color:

Black

Cure schedule, Alternate, @ 165.0 °C:

90.0 min.

Cure schedule, Recommended, @ 125.0 °C:

30.0 min.

Cure type:

Heat Cure

Filler:

73.0 %

Glass transition temperature (Tg):

155.0 °C

Operating temperature:

-65.0 °C - 150.0 °C

Specific gravity, @ 25.0 °C:

1.77

Storage temperature:

-40.0 °C

Viscosity, Brookfield - RVT, @ 25.0 °C:

43900.0 mPa·s (cP)

Please contact us for ordering options

Request a consultation

Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.