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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal GAP PAD Materials

BERGQUIST® GAP PAD® TGP 3000

Soft, fiberglass reinforced insulation pad - low stress applications

Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.

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Documents

Information

BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.

Product category:

Thermal GAP PAD Materials

Technologies:

Color:

Light blue

Density:

3.2 g/cm³

Dielectric breakdown voltage:

3000.0 Vac

Dielectric constant, ASTM D150, @ 1kHz:

7.0

Flame rating:

V-0

Heat capacity, ASTM E1269:

1.0 J/g-K

Operating temperature:

-60.0 °C - 200.0 °C

Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:

30.0

Standard thickness:

0.254 mm - 3.175 mm

Volume resistivity:

1×10 Ohm m

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