Thermal GAP PAD Materials
Soft, fiberglass-reinforced insulation pad - low stress applications
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
BERGQUIST® GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. It is highly conformable and exhibits thermal resistance and softness. It is fiberglass-reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
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Thermal conductivity: 3.0 W/m-K
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Low thermal resistance at very low pressures
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Highly conformable softness
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Designed for low-stress applications
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For information on our thermal management materials' UL certifications, please refer to UL file E59150
- Product category:
- Thermal GAP PAD Materials
Technologies:
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Thermal management, gap pads
- Color:
- Light blue
- Density:
- 3.2 g/cm³
- Dielectric breakdown voltage:
- 3000.0 Vac
- Dielectric constant, ASTM D150, @ 1kHz:
- 7.0
- Flame rating:
- V-0
- Heat capacity, ASTM E1269:
- 1.0 J/g-K
- Operating temperature:
- -60.0 °C - 200.0 °C
- Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:
- 30.0
- Standard thickness:
- 0.254 mm - 3.175 mm
- Volume resistivity:
- 1×10 Ohm m
