Thermal GAP PAD Materials
Soft, fibreglass reinforced insulation pad - low stress applications
Thermally conductive, silicone-based, fiberglass reinforced gap pad filler with a high thermal conductivity rating of 3.0 W/m-K. Soft “S-Class” Gap Filler for low stress sensitive applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Technical specification
BERGQUIST® GAP PAD TGP 3000 is a pre-cured silicone based, thermally conductive, reinforced gap pad. This product is highly conformable and exhibits S class thermal resistance and softness. It is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
For information on UL certifications for our Thermal Management Materials Portfolio, please reference to UL file No. E59150.
Dielectric breakdown voltage:
Dielectric constant, ASTM D150, @ 1kHz:
Heat capacity, ASTM E1269:
-60.0 °C - 200.0 °C
Shore hardness, Thirty second delay value, ASTM D2240, Bulk Rubber, Shore 00:
0.254 mm - 3.175 mm
1×10 Ohm m