Part no. (SKU/IDH):
2050718
IDH Name:
TECHNOMELT® PA 6771 BLACK, 20 kg Sack
Hot melt adhesives
Easily moldable hot melt for fragile components and outdoor applications
A 1-part, low-viscosity, moldable hot melt adhesive that is a resilient encapsulant with great heat stability, UV stability, and moisture resistance.
Part no. (SKU/IDH):
2050718
IDH Name:
TECHNOMELT® PA 6771 BLACK, 20 kg Sack
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
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- Description
- Technical specification
- Ratings & reviews
- Question & answer
TECHNOMELT® PA 6771 BLACK is a 1-part polyamide hot melt adhesive specially designed for low pressure molding processes. Its low viscosity makes it ideal for encapsulating fragile components without damage. Once applied, it solidifies to form a barrier between electronics and the environment. It is a resilient encapsulant with great heat stability, UV stability, and moisture resistance. Perfect for potting electronics modules, molding strain relief into wiring, and encapsulation of sensors, especially in outdoor applications. This is a versatile adhesive for a variety of substrates, including FR4, metals, and plastics including ABS, PC.
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1-part: no mixing
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Low viscosity
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Molding temperature 210°C to 240°C (410°F to 464°F)
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Easy moldability
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UV stable: suitable for outdoor applications
- Product category:
- Hot melt adhesives
Technologies:
-
Hot Melts, polyamide
- Applications:
- Encapsulating
- Color:
- Black
- Key characteristics:
- Viscosity: low viscosity
- Number of components:
- 1 part
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Large volume or special order?
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