Hot melt adhesives
Polyamide-based hot melt adhesive for encapsulation applications
One-part, polyamide-based hot melt adhesive for thermoplastic molding compound applications.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
When you want a thermoplastic hotmelt where streamlined manufacturing and end-product protection are needed, TECHNOMELT® PA 6208 N BLACK is an ideal choice. This polyamide-based adhesive is ideal for encapsulation applications, and offers simplified processing. It is compatible with a variety of substrates, including metals and ABS plastic, and has an operating temperature range between -40°C to 100°C (-40 to 212°F) depending on the application – and without mechanical stress. TECHNOMELT® PA 6208 N BLACK meets UL Flammability Rating UL 94 V-0.
-
Compatible with a variety of substrates
-
Operating temperature range: -40°C to 100°C (-40°F to 212°F)
-
1-part: no mixing required
-
Meets UL Flammability Rating UL 94 V-0
- Product category:
- Hot melt adhesives
Technologies:
-
Hot Melts, polyamide
- Color:
- Black
- Density:
- 0.98 g/cm³
- Melt viscosity, @ 210.0 °C:
- 2400.0 mPa·s - 4000.0 mPa·s
- Softening point temperature:
- 155.0 °C
