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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Potting compounds


Two-part, thermally conductive epoxy encapsulant

Epoxy encapsulant for replacing heatsinks in non-integrated electrical components and assemblies.d electrical components and assemblies.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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If you're looking for a low-viscosity encapsulant with excellent adhesion and low-temperature properties, LOCTITE® STYCAST 2850KT BL is a great pick. This epoxy-based encapsulant is uniquely designed for heatsink replacement in non-integrated electrical components and assemblies. It can resist thermal shock and impact, making it ideal for high-voltage applications where surface arching or tracking is a concern. LOCTITE® STYCAST 2850KT BL is tested to perform seamlessly in applications with an operating range of -85°F (-65°C) to 221°F (105°C) and is compatible with a variety of LOCTITE® catalysts. We always recommend contacting a local technical service representative for assistance and recommendations on mixed properties.

Product category:





Coefficient of thermal expansion (CTE), Above Tg:

78.7 ppm/°C

Coefficient of thermal expansion (CTE), Below Tg:

24.3 ppm/°C



Cure schedule, @ 25.0 °C:

8.0 hr. - 16.0 hr.

Cure schedule, @ 45.0 °C:

2.0 hr. - 4.0 hr.

Cure schedule, @ 65.0 °C:

0.5 hr. - 1.0 hr.

Cure type:

Room temperature (ambient) cure


2.7 g/cm³

Glass transition temperature (Tg):

40.0 °C

Mix ratio, by weight:

10 : 4.5

Mixed: Viscosity, Brookfield:

22000.0 mPa·s (cP)

Number of components:

2 part

Operating temperature:

-65.0 °C - 105.0 °C

Shelf life:

180.0 day

Shore hardness, Shore D:


Specific gravity, @ 25.0 °C:


Thermal conductivity:

2.29 W/mK

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