Potting compounds
Two-part, thermally conductive epoxy encapsulant
Epoxy encapsulant for replacing heatsinks in non-integrated electrical components and assemblies.d electrical components and assemblies.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
If you're looking for a low-viscosity encapsulant with excellent adhesion and low-temperature properties, LOCTITE® STYCAST 2850KT BL is a great pick. This epoxy-based encapsulant is uniquely designed for heatsink replacement in non-integrated electrical components and assemblies. It can resist thermal shock and impact, making it ideal for high-voltage applications where surface arching or tracking is a concern. LOCTITE® STYCAST 2850KT BL is tested to perform seamlessly in applications with an operating range of -85°F (-65°C) to 221°F (105°C) and is compatible with a variety of LOCTITE® catalysts. We always recommend contacting a local technical service representative for assistance and recommendations on mixed properties.
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Thermal shock and impact-resistant
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High thermal conductivity
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Low coefficient of thermal expansion (CTE)
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Can be used with a variety of catalysts
Applications:
Encapsulating
Coefficient of thermal expansion (CTE), Above Tg:
78.7 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg:
24.3 ppm/°C
Color:
Blue
Cure schedule, @ 25.0 °C:
8.0 hr. - 16.0 hr.
Cure schedule, @ 45.0 °C:
2.0 hr. - 4.0 hr.
Cure schedule, @ 65.0 °C:
0.5 hr. - 1.0 hr.
Cure type:
Room temperature (ambient) cure
Density:
2.7 g/cm³
Glass transition temperature (Tg):
40.0 °C
Mix ratio, by weight:
10 : 4.5
Mixed: Viscosity, Brookfield:
22000.0 mPa·s (cP)
Number of components:
2 part
Operating temperature:
-65.0 °C - 105.0 °C
Shelf life:
180.0 day
Shore hardness, Shore D:
92.0
Specific gravity, @ 25.0 °C:
1.08
Thermal conductivity:
2.29 W/mK