Potting compounds
Thermally conductive epoxy encapsulant
This 2-part epoxy encapsulant is for replacing heatsinks in non-integrated electrical components and assemblies.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® STYCAST 2850KT BL is a low-viscosity epoxy-based encapsulant with excellent adhesion and low-temperature properties. It is uniquely designed for heatsink replacement in non-integrated electrical components and assemblies, and can resist thermal shock and impact, making it ideal for high-voltage applications where surface arching or tracking is a concern. It is tested to perform seamlessly in applications with an operating range of -65°C to 105°C (-85°F to 221°F) and is compatible with a variety of LOCTITE catalysts.
-
Thermal shock- and impact-resistant
-
High thermal conductivity
-
Low coefficient of thermal expansion (CTE)
-
Can be used with a variety of catalysts
-
-
- Product category:
- Encapsulants
Technologies:
-
Thermosets, electronics assembly materials
- Applications:
- Encapsulating
- Coefficient of thermal expansion (CTE), Above Tg:
- 78.7 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 24.3 ppm/°C
- Color:
- Blue
- Cure schedule, @ 25.0 °C:
- 8.0 hr. - 16.0 hr.
- Cure schedule, @ 45.0 °C:
- 2.0 hr. - 4.0 hr.
- Cure schedule, @ 65.0 °C:
- 0.5 hr. - 1.0 hr.
- Cure type:
- Room temperature (ambient) cure
- Density:
- 2.7 g/cm³
- Glass transition temperature (Tg):
- 40.0 °C
- Mix ratio, by weight:
- 10 : 4.5
- Mixed: Viscosity, Brookfield:
- 22000.0 mPa·s (cP)
- Number of components:
- 2 part
- Operating temperature:
- -65.0 °C - 105.0 °C
- Shelf life:
- 180.0 day
- Shore hardness, Shore D:
- 92.0
- Specific gravity, @ 25.0 °C:
- 1.08
- Thermal conductivity:
- 2.29 W/mK
