Part no. (SKU/IDH):
1049155
IDH Name:
LOCTITE® ECCOBOND FP4802, 30 cc Syringe
Encapsulants
High-purity encapsulant for applications utilizing lead-free solder
A 1-part, black, high-purity encapsulant designed for applications utilizing lead-free solder. It's suitable for protecting bare chips in a variety of advanced packages.
Part no. (SKU/IDH):
1049155
IDH Name:
LOCTITE® ECCOBOND FP4802, 30 cc Syringe
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
- Description
- Technical specification
- Question & answer
LOCTITE® ECCOBOND FP4802 is a black, high-purity liquid encapsulant specially designed for use in applications utilizing lead-free solder. It was formulated to meet the non-halide objectives of many technical users and for temperature cycling ranges up to-65 to 150°C (-40°F to 302°F). It features excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. It is ideal for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs), Plastic Ball Grid Arrays (PBGAs), and full arrays on Low Temperature cofired Ceramic (LTCC).
-
Temperature cycling range: -85°C to 150 °C (-40°F to 302°F)
-
Excellent flow properties
-
Protects bare chips in various advanced packages
-
High purity
- Product category:
- Encapsulants
Technologies:
-
Electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 100.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 20.0 ppm/°C
- Extractable ionic content, Chloride (CI-):
- 5.0 ppm
- Extractable ionic content, Potassium (K+):
- 5.0 ppm
- Extractable ionic content, Sodium (Na+):
- 5.0 ppm
- Glass transition temperature (Tg):
- 50.0 °C
- Storage temperature:
- -40.0 °C
- Viscosity, Brookfield - HBT, @ 25.0 °C:
- 80000.0 mPa·s (cP)
-
{{#data}}
{{#distributor.isVisible}}
{{#distributor.isExpanded}}
-
{{^distributor.unique}}
{{/distributor.unique}}
{{#distributor.onShelf}} {{#distributor.withSpecialPrice}} {{distributor.prices.specialWithSymbol}}
{{distributor.prices.regularWithSymbol}}
{{#distributor.withoutSpecialPrice}} {{distributor.prices.regularWithSymbol}}
{{#distributor.anyInStock}} {{/distributor.anyInStock}}In stock {{#distributor.notInStock}} {{/distributor.notInStock}}Out of stock {{#distributor.notOnShelf}} {{^distributor.notInStock}} {{#distributor.onShelf}} All available stock is already in cartYou have reached the maximum order quantity availableFor industrial use only. Not intended for consumer sale or use.
Large volume or special order?
{{#distributor.notOnShelf}} {{/distributor.notInStock}}{{#distributor.notInStock}} {{#distributor.onShelf}} {{#distributor.notInStock}} {{/distributor.onShelf}}There was a problem with your request. Please try again or contact us directly.
Our experts are here to learn more about your needs.
Our support center and experts are ready to help you find solutions for your business needs.