Encapsulants
High-purity encapsulant for applications utilizing lead-free solder
This black, high-purity encapsulant is designed for applications utilizing lead-free solder. It's suitable for protecting bare chips in a variety of advanced packages.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Description
- Technical specification
- Ratings & reviews
- Question & answer
LOCTITE® ECCOBOND FP4802 is a black, high-purity liquid encapsulant specially designed for use in applications utilizing lead-free solder. It was formulated to meet the non-halide objectives of many technical users and for temperature cycling ranges up to-65 to 150°C (-40°F to 302°F). It features excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. It is ideal for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs), Plastic Ball Grid Arrays (PBGAs), and full arrays on Low Temperature cofired Ceramic (LTCC).
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Temperature cycling range: -85°C to 150 °C (-40°F to 302°F)
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Excellent flow properties
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Protects bare chips in various advanced packages
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High purity
- Product category:
- Encapsulants
Technologies:
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Thermosets, electronics assembly materials
- Coefficient of thermal expansion (CTE), Above Tg:
- 100.0 ppm/°C
- Coefficient of thermal expansion (CTE), Below Tg:
- 20.0 ppm/°C
- Extractable ionic content, Chloride (CI-):
- 5.0 ppm
- Extractable ionic content, Potassium (K+):
- 5.0 ppm
- Extractable ionic content, Sodium (Na+):
- 5.0 ppm
- Glass transition temperature (Tg):
- 50.0 °C
- Storage temperature:
- -40.0 °C
- Viscosity, Brookfield - HBT, @ 25.0 °C:
- 80000.0 mPa·s (cP)
