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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Loctite Technology Cluster Brand for Product Detail Pages

Part no. (SKU/IDH):
1049155

IDH Name:
LOCTITE® ECCOBOND FP4802, 30 cc Syringe

Encapsulants

LOCTITE® ECCOBOND FP4802

High-purity encapsulant for applications utilizing lead-free solder

A 1-part, black, high-purity encapsulant designed for applications utilizing lead-free solder. It's suitable for protecting bare chips in a variety of advanced packages.

Part no. (SKU/IDH):
1049155

IDH Name:
LOCTITE® ECCOBOND FP4802, 30 cc Syringe

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

Information

LOCTITE® ECCOBOND FP4802 is a black, high-purity liquid encapsulant specially designed for use in applications utilizing lead-free solder. It was formulated to meet the non-halide objectives of many technical users and for temperature cycling ranges up to-65 to 150°C (-40°F to 302°F). It features excellent flow properties, allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control. It is ideal for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGAs), Chip Scale Packages (CSPs), Plastic Ball Grid Arrays (PBGAs), and full arrays on Low Temperature cofired Ceramic (LTCC).

  • Product category:
  • Encapsulants

Technologies:

  • Coefficient of thermal expansion (CTE), Above Tg:
  • 100.0 ppm/°C

 

  • Coefficient of thermal expansion (CTE), Below Tg:
  • 20.0 ppm/°C

 

  • Extractable ionic content, Chloride (CI-):
  • 5.0 ppm

 

  • Extractable ionic content, Potassium (K+):
  • 5.0 ppm

 

  • Extractable ionic content, Sodium (Na+):
  • 5.0 ppm

 

  • Glass transition temperature (Tg):
  • 50.0 °C

 

  • Storage temperature:
  • -40.0 °C

 

  • Viscosity, Brookfield - HBT, @ 25.0 °C:
  • 80000.0 mPa·s (cP)

 

     

       

         

           

             

               

                 

                   

                     

                       

                         

                           

                             

                               

                                 

                                   

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