Products

Heat-curing epoxy potting compound

Curing agent/hardener for use with potting and encapsulating resins

Halogen- and silicone-free peelable hot melt adhesive

Thermally conductive epoxy encapsulant

Low-viscosity, low abrasion, general purpose filled encapsulant  

Black epoxy underfill for preventing mechanical stress

Easily reworkable, fast-drying protection layer​ for circuit boards

Epoxy underfill with excellent thermal performance

Halogen-free epoxy underfill

Conformal coating providing environmental protection for electronic components 

UV-curable edge bond adhesive for chips

Low-viscosity urethane potting compound