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Henkel Adhesive Technologies

Henkel Adhesive Technologies

Thermal management solutions for thick gap applications

Dive deep into thermal interface materials (TIMs) in our latest podcast. Discover insights on liquid vs. pad solutions and crucial considerations for optimal heat dissipation in electronic systems.

Peter Jones
Senior Application Engineer

10 min.

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Dive into the complex world of thermal interface materials (TIMs) in electronic system design in our latest podcast. Focusing on thicker gaps, we explore challenges with insulating air gaps in heat sinks. The episode delves into the liquid vs. pad debate, defining "thick" gaps and comparing thermal pads with liquid gap fillers. Further, we dissect the distinctions between two-part liquid and gel TIMs. Beyond this, our discussion emphasizes crucial considerations like resin chemistry and thermal conductivity, guiding optimal TIM selection for effective heat dissipation in electronic devices. Discover more insights by listening to the podcast or reading the accompanying article.

Key insights

Featured speaker

A profile image of Peter Jones

Peter Jones
Senior Application Engineer
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Peter Jones is a Senior Application Engineer for Thermal Interface Materials in Power and Industrial Automation within the company’s Adhesive Technology business unit.

Peter joined Henkel in early 2022 from Momentive Performance Materials where he also served as an Application Engineer. He has a background working with silicone adhesives and sealants, specifically in the Aerospace Industry.

Peter holds a Bachelor’s degree in Materials Science and Engineering with a minor in Sustainability Studies from Rensselaer Polytechnic University.

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