Thermal and protective materials for storage and processors

AI applications require massive computing power and speed. As enterprises move to implement AI apps in-house and data centers seek greater efficiency, robust and reliable hardware is critical. This includes a combination of servers with ultra-fast GPU processors and AI accelerators, along with hard disk drive (HDD) and solid-state drive (SSD) storage to get the job done. Because of this, as reported earlier (https://finance.yahoo.com/news/solid-state-drive-market-rockets-134500696.html), the SSD market is projected to witness over 15% CAGR through the end of 2030, and the explosive trajectory of market-leading GPU innovators continues as processors maintain their double-digit expansion record.

Whether in storage or processing, one fact remains consistent: demands for greater computational power are making system and package designs more complex. High-capacity SSDs, for example, are delivering exceptionally fast read-write capability, fueled by advances in flash memory efficiency instead of HDDs' mechanical components approach. This results in remarkable speeds more than 30x faster (https://www.enterprisestorageforum.com/hardware/ssd-vs-hdd-speed)  than HDD’s 200MB/s. That’s not to say SSDs will eclipse HDDs anytime soon, as applications require a balanced approach to cost and latency considerations. Regardless, both storage solutions must deliver reliability and responsiveness. Likewise, processor package designs are incorporating 2.5D and 3D chip stacking and larger substrates as heterogeneous integration moves the operating capability needle.  The composite result is highly compact, computationally powerful, electronically dense devices that are more heat-generating, increasingly susceptible to stress, and challenging to safeguard. 

The more power and speed packed into storage and processor designs, the higher the thermal load, and the greater the opportunity for electronic component mechanical strain. No matter how brilliantly designed next-gen storage and processor electronic subsystems are, if an electrical interconnect is damaged or excessive heat limits speed, performance promises are at risk. Thermal control and board- and package-level connection fortification are fundamental to meeting reliability expectations for high-value SSDs, HDDs, and GPUs, ensuring maximized performance in demanding compute-intensive AI applications. On-device thermal management materials in multiple formats and a broad portfolio of semiconductor and board-level underfill solutions provide a reliability and efficiency boost for the systems fueling today's data-driven economy.

Discover what’s possible with highly-capable Henkel materials:

In collaboration with immersion cooling innovator Submer, Henkel evaluated immersion cooling fluids' impact on two electronic materials vital to data center subsystem reliability – thermal interface materials (TIMs) and underfill encapsulants. The findings offer crucial insights into the performance of these materials in high efficiency cooling systems, enhancing both thermal performance and system longevity.

Read the full whitepaper to discover how these findings can impact your data center’s thermal management strategy and ensure long-term reliability: https://next.henkel-adhesives.com/us/en/white-papers/ensuring-reliability-in-the-data-center-deep-end.html

Interconnect protection and thermal control are linchpins for maximized AI performance. Learn how to ensure your devices are fortified for functionality.