Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

White Paper

Mobile antennas and power devices that break the mold

Active Mold Packaging (AM) technique has opened doors to diverse applications, particularly in achieving miniaturization goals.

This is a front cover for the white paper mobile antennas

By using plateable compounds, AMP represents a highly-efficient approach to expanding the electrical  function – as well as offering EMI and thermal protection mechanisms – of IC packages without enlarging the footprint and, in many cases, allowing reduction of overall package dimensions.

Key insights

Looking for solutions? We can help

Our experts are here to learn more about your needs.

  • A female call-center employee smiling and wearing a headset while working in an office.

    Request a consultation

  • LOCTITE 263 Threadlocker - Application on Bolt

    Request a sample

  • A black female employee scans packages in a warehouse. In the foreground there is the woman with the yellow scanner, in the background scaffolding can be seen.

    Submit an order request

Looking for more support options?

Our support center and experts are ready to help you find solutions for your business needs.