Skip to Content
Henkel Adhesive Technologies

Henkel Adhesive Technologies

White Paper

LCM a reliability boon for fan-in and fan-out technology

High-yield processing and in-field reliability for various advanced wafer-level packaging applications.

This is the front cover for the white paper

Wafer-level packaging applications have seen explosive growth as they continue to be key enablers of innovation in the next-gen broadband technology. Expansion of functionality within current – or smaller – footprints is driving architectural changes at the wafer level that dictate a need for robust and reliability-enhancing encapsulation materials. Henkel’s portfolio of wafer-level encapsulants offers a variety of solutions to facilitate high-yield processing and in-field reliability for various advanced wafer-level packaging applications.

Key insights

Looking for solutions? We can help

Our experts are here to learn more about your needs.

  • A female call-center employee smiling and wearing a headset while working in an office.

    Request a consultation

  • LOCTITE 263 Threadlocker - Application on Bolt

    Request a sample

  • A black female employee scans packages in a warehouse. In the foreground there is the woman with the yellow scanner, in the background scaffolding can be seen.

    Submit an order request

Looking for more support options?

Our support center and experts are ready to help you find solutions for your business needs.