White paper
High-yield processing and in-field reliability for various advanced wafer-level packaging applications.
Wafer-level packaging applications have seen explosive growth as they continue to be key enablers of innovation in the next-gen broadband technology. Expansion of functionality within current – or smaller – footprints is driving architectural changes at the wafer level that dictate a need for robust and reliability-enhancing encapsulation materials. Henkel’s portfolio of wafer-level encapsulants offers a variety of solutions to facilitate high-yield processing and in-field reliability for various advanced wafer-level packaging applications.
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