White Paper
Discover how filler technology enhances processability, thermal performance and reliability of non-conductive die attach paste for automotive grade 0 application.
In order to meet strict automotive reliability criteria, die attach adhesives must successfully undergo thermal cycling and high-temperature storage tests. Henkel has introduced a high thermal conductivity die attach paste with advanced filler technology. This innovative solution provides outstanding dispensability, thin bond line capability, and meets automotive grade 0 standards, making it a perfect choice for applications demanding exceptional reliability.
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