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Henkel Adhesive Technologies

Henkel Adhesive Technologies

White Paper

High thermal ncDAP for auto zero reliability

Discover how filler technology enhances processability, thermal performance and reliability of non-conductive die attach paste for automotive grade 0 application.

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In order to meet strict automotive reliability criteria, die attach adhesives must successfully undergo thermal cycling and high-temperature storage tests. Henkel has introduced a high thermal conductivity die attach paste with advanced filler technology. This innovative solution provides outstanding dispensability, thin bond line capability, and meets automotive grade 0 standards, making it a perfect choice for applications demanding exceptional reliability.

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