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Henkel Adhesive Technologies

Henkel Adhesive Technologies

White Paper

Formulating NCP and NCF for optimal results

Understand the optimization of NCP and NCF formulations and processing to ensure robust joint protection flip chip interconnects.

This is the front cover of the white paper

This whtepaper provided insight on both NCP and NCF within the TCB process to better understand key material properties and process parameters to produce high-reliability outcomes.

Key insights

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