White Paper

Cost-competitive CDAF enables cost-effective laminate packages

Henkel's complete portolfio of conductive die attach film materials capability spans a broad spectrum of package type - laminated packages, die sizes and cost/performance ratios.

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Henkel’s cDAF material development has centered on solutions for leadframe packages – and to overwhelming market acceptance. Henkel now brings the unmatched benefits of cDAF to manufacturers of laminate-based devices by introducting LOCTITE ABLESTIK CDF 600P to the market.

Key insights

Benefit of film over paste
Overview for Henkel CDAF portfolio for leadframe packages
Introduction of LOCTITE ABLESTIK CDF 600P, the industry’s first cDAF material designed for use with many of today’s laminate packages.

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Cost-competitive CDAF enables cost-effective laminate packages

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