Cutting-edge semiconductor innovation is the determinant of data center computational power, data and workload processing speed, energy efficiency, and reliability. And advanced semiconductor packaging materials are foundational to device performance.
by 2030
The total semiconductor data center market is estimated to significantly increase over the next four years1.
CAGR for HBM
Data center high bandwidth memory growth is set to accelerate through 2030, with revenue projected to exceed $5 billion2.
CPO to exceed by 2031
Surging bandwidth requirements, energy efficiency demands, and the thermal limits of traditional pluggable optical modules are driving adoption of co-packaged optics3.
Heterogeneously integrated 2.5D and 3D packages are the foundation of AI performance, but their challenging architectures are highly susceptible to thermal and mechanical stresses. Advanced packaging materials hold the key to ensuring long-term reliability.
- Heterogeneous integration for AI accelerators
- Co-packaged optics
- High bandwidth memory
LMUF fills gaps to deliver mechanical support and stress relief, protecting interconnects between dies and substrates, providing single-step underfill and overmolding protection in heterogeneously integrated packages. Henkel LMUF offers good flow characteristics, controlled curing, fine gap filling capability, and optimized CTE for excellent warpage control.
Engineered for protection of thin, large die, Henkel capillary underfills for 2.5D packages completely encapsulate fine-pitch, low-gap-height die interconnects for excellent protection against stress. The materials exhibit fast flow, long gel times, low shrinkage for die and underfill crack resistance, and low CTE for warpage protection.
Lid and stiffener attach adhesives help maintain package and die stability, reduce warpage, and enable efficient thermal transfer from the package to the lid, improving package reliability.
Heterogeneous integration through 2.5D and 3D packaging architectures is delivering generational performance gains for AI. Latency is reduced and bandwidth is increased, which is essential for AI and HPC applications. However, the higher-density designs and large package bodies of 2.5D and 3D devices present thermal, mechanical, and reliability challenges that only innovative materials can overcome.
Available in capillary, TC NCP, TC NCF, and LMUF formulations, Henkel offers multiple interconnect protection options for co-packaged optics chips to accommodate diverse processing preferences. This includes high thermal capillary underfills that help address the sensitive mechanical stability and heat control requirements of high-density, co-packaged optical engines and ASICs.
High thermal conductivity, low modulus, snap-curable thermal adhesives designed for co-packaged optics ensure processability, optimal heat transfer, mechanical durability, and optical stability.
Index matching optical fiber light path pastes bond delicate optical fibers, while Henkel index matching optical film adhesives bond the glass block to the photonic integrated circuit (PIC). Both types of adhesives can withstand 260° C reflow with no performance degradation.
Co-packaged optics (CPO) represents a fundamental shift in networking architecture, integrating optical transceiver capabilities and switching chips into a single package. The result? Improved signal integrity, greater power efficiency, and higher performance. Ensuring these outcomes requires protecting interconnects, managing operating temperatures, and guarding against optical interference.
LMUF fills gaps to deliver mechanical support and stress relief to protect interconnects between dies in high bandwidth memory die stacks, providing underfill and overmolding protection. Henkel LMUF offers good flow characteristics, controlled curing, fine gap filling capability, and optimized CTE for excellent warpage control.
Thermocompression non-conductive film (TC NCF) underfill is applied on the wafer prior to thermocompression bonding. The film format ensures good flow, controlled fillet formation, robust bump protection, and is ideal for thin die stacking in HBM applications.
Henkel anhydride-free liquid compression molding materials provide excellent warpage protection, ensure void-free encapsulation around the dies in the HBM stack, and ensure low voiding and good thickness control.
High bandwidth memory (HBM) is crucial for AI accelerators and high-performance computing. HBM, using 3D vertically stacked dies, delivers the massive bandwidth required by the workloads inherent to AI applications. Thermal control and fine-pitch interconnect fortification are essential for optimized performance, protection against thermomechanical stress, and long-term reliability of the stack and the integrated package.
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