Henkel Adhesive Technologies

Henkel Adhesive Technologies

Hot melt adhesives


Polyamide-based hot-melt adhesive for encapsulation applications

One-part, polyamide-based hot-melt adhesive for thermoplastic molding compound applications.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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When you want a thermoplastic hotmelt where streamlined manufacturing and end-product protection are needed, TECHNOMELT® PA 6208 N BLACK is an ideal choice. This polyamide-based adhesive is ideal for encapsulation applications and offers simplified processing. TECHNOMELT® PA 6208 N BLACK is compatible with a variety of substrates, including metals and ABS plastic, and has an operating temperature range between -40 to 212°F (-40 to 100°C) depending on the application – and without mechanical stress. TECHNOMELT® PA 6208 N BLACK meets UL Flammability Rating UL 94 V-0.




0.98 g/cm³

Melt viscosity, @ 210.0 °C:

2400.0 mPa·s - 4000.0 mPa·s

Softening point temperature:

155.0 °C

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Unplanned downtime or lower plant productivity can prevent you from achieving the manufacturing excellence that you are looking for. Consult with our experts to find ways to make your machine more reliable and reduce unplanned downtime to save costs.