Henkel Adhesive Technologies

Henkel Adhesive Technologies

Hot melt adhesives

TECHNOMELT® PA 6208 N BLACK

Polyamide-based hot-melt adhesive for encapsulation applications

One-part, polyamide-based hot-melt adhesive for thermoplastic molding compound applications.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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Information

When you want a thermoplastic hotmelt where streamlined manufacturing and end-product protection are needed, TECHNOMELT® PA 6208 N BLACK is an ideal choice. This polyamide-based adhesive is ideal for encapsulation applications and offers simplified processing. TECHNOMELT® PA 6208 N BLACK is compatible with a variety of substrates, including metals and ABS plastic, and has an operating temperature range between -40 to 212°F (-40 to 100°C) depending on the application – and without mechanical stress. TECHNOMELT® PA 6208 N BLACK meets UL Flammability Rating UL 94 V-0.

Color:

Black

Density:

0.98 g/cm³

Melt viscosity, @ 210.0 °C:

2400.0 mPa·s - 4000.0 mPa·s

Softening point temperature:

155.0 °C

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