Die attach adhesives
Popular electrically conductive adhesive for high speed dispensing
This rigid epoxy-based die attach adhesive is a widely used for small components assembly.
All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.
- Technical specification
As one of the most widely used die attach products in the semiconductor industry, you can rely on LOCTITE® ABLESTIK 84-1LMISR4. This electrically conductive adhesive is specially formulated for use in high throughput, automated die attach equipment. Expect minimum adhesive dispense and die put down dwell times, minimal tailing and stringing, and an up to two week work life for small series assemblies.
Coefficient of thermal expansion (CTE):
Coefficient of thermal expansion (CTE), Above Tg:
Cure schedule, @ 175.0 °C:
Extractable ionic content, Chloride (CI-):
Extractable ionic content, Potassium (K+):
Extractable ionic content, Sodium (Na+):
Glass transition temperature (Tg):
Moisture absorption, 168 hr. @ 85°C/85% RH:
Number of components:
Recommended for use with:
LeadFrame: Gold,LeadFrame: Silver
Tensile modulus, @ 250.0 °C:
300.0 N/mm² (44000.0 psi)
Viscosity, Brookfield CP51, @ 25.0 °C:
8000.0 mPa·s (cP)
≤ 0.0002 Ohm cm