Henkel Adhesive Technologies

Henkel Adhesive Technologies

Die attach adhesives


Popular electrically conductive adhesive for high speed dispensing

This rigid epoxy-based die attach adhesive is a widely used for small components assembly​.

All marks used are trademarks and/or registered trademarks of Henkel and its affiliates in the US, Germany, and elsewhere.

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As one of the most widely used die attach products in the semiconductor industry, you can rely on LOCTITE® ABLESTIK 84-1LMISR4. This electrically conductive adhesive is specially formulated for use in high throughput, automated die attach equipment. Expect minimum adhesive dispense and die put down dwell times, minimal tailing and stringing, and an up to two week work life for small series assemblies.

Application method:

Dispense System


Die Attach

Coefficient of thermal expansion (CTE):

40.0 ppm/°C

Coefficient of thermal expansion (CTE), Above Tg:

150.0 ppm/°C



Cure schedule, @ 175.0 °C:

1.0 hr.

Cure type:

Heat Cure

Extractable ionic content, Chloride (CI-):

20.0 ppm

Extractable ionic content, Potassium (K+):

10.0 ppm

Extractable ionic content, Sodium (Na+):

10.0 ppm

Glass transition temperature (Tg):

120.0 °C

Moisture absorption, 168 hr. @ 85°C/85% RH:

0.6 %

Number of components:

1 Part

Physical form:


Recommended for use with:

LeadFrame: Gold,LeadFrame: Silver

Tensile modulus, @ 250.0 °C:

300.0 N/mm² (44000.0 psi)

Thermal conductivity:

2.5 W/mK

Thixotropic index:


Viscosity, Brookfield CP51, @ 25.0 °C:

8000.0 mPa·s (cP)

Volume resistivity:

≤ 0.0002 Ohm cm

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