White paper

Ensuring reliability in the data center deep end

An evaluation of thermal interface material and underfill compatibility with liquid immersion cooling fluids.

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We, Henkel Hellas SA, 23, Kyprou str, 18346, Moschato, Athens, Greece would like to personalise our digital services, retail activities and online advertising based on an analysis of your interactions with us, our websites and services (as stated under Read More), to provide you and the company you are representing, with the most relevant and interesting content.

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Server rack stacked with digital matrix vector of 0s and 1s

In collaboration with immersion cooling innovator Submer, Henkel evaluated immersion cooling fluids' impact on two electronic materials vital to data center subsystem reliability – thermal interface materials (TIMs) and underfill encapsulants. The study results reveal insight into material selection for data center-destined PCBs.

This white paper aims to provide some answers:

Do TIMs and underfills experience material degradation during exposure to immersion cooling fluids?
If material physical changes occur, do they impact performance?
Which cooling fluids performed best with low-volatility materials?
Which underfills passed all tests?

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Ensuring reliability in the data center deep end

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This white paper aims to provide some answers:

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